| The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ... IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004 | 181 | 2004 |
| Nanopackaging: Nanotechnologies and electronics packaging JE Morris Nanopackaging: Nanotechnologies and Electronics Packaging, 1-44, 2018 | 128 | 2018 |
| Colloidal processing of polymer ceramic nanocomposite integral capacitors H Windlass, PM Raj, D Balaraman, SK Bhattacharya, RR Tummala IEEE transactions on electronics packaging manufacturing 26 (2), 100-105, 2003 | 127 | 2003 |
| 2005 IEEE 55th Electronic Components and Technology Conference Institute of Electrical and Electronics Engineers, Inc. Staff IEEE, 2005 | 107* | 2005 |
| Anisotropic shrinkage in tape‐cast alumina: Role of processing parameters and particle shape PM Raj, WR Cannon Journal of the American Ceramic Society 82 (10), 2619-2625, 1999 | 103 | 1999 |
| A review of 5G front-end systems package integration AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 92 | 2020 |
| Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications H Windlass, PM Raj, D Balaraman, SK Bhattacharya, RR Tummala IEEE transactions on advanced packaging 26 (1), 10-16, 2003 | 78 | 2003 |
| Anisotropic shrinkage during sintering of particle-oriented systems—numerical simulation and experimental studies PM Raj, A Odulena, WR Cannon Acta materialia 50 (10), 2559-2570, 2002 | 75 | 2002 |
| Trend from ICs to 3D ICs to 3D systems RR Tummala, V Sundaram, R Chatterjee, PM Raj, N Kumbhat, ... 2009 IEEE Custom Integrated Circuits Conference, 439-444, 2009 | 67 | 2009 |
| First demonstration of compact, ultra-thin low-pass and bandpass filters for 5g small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ... IEEE Microwave and wireless components letters 28 (12), 1110-1112, 2018 | 51 | 2018 |
| Antenna miniaturization using magneto-dielectric substrates N Altunyurt, M Swaminathan, PM Raj, V Nair 2009 59th Electronic Components and Technology Conference, 801-808, 2009 | 51 | 2009 |
| Magneto-dielectric nanocomposite for antenna miniaturization and SAR reduction K Han, M Swaminathan, R Pulugurtha, H Sharma, R Tummala, S Yang, ... IEEE Antennas and Wireless Propagation Letters 15, 72-75, 2015 | 48 | 2015 |
| Copper interconnections for high performance and fine pitch flip chip digital applications and ultra-miniaturized RF module applications RR Tummala, PM Raj, A Aggarwal, G Mehrotra, SW Koh, S Bansal, ... 56th Electronic Components and Technology Conference 2006, 10 pp., 2006 | 41 | 2006 |
| Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF N Kumbhat, A Choudhury, M Raine, G Mehrotra, PM Raj, R Zhang, ... 2009 59th Electronic Components and Technology Conference, 1479-1485, 2009 | 39 | 2009 |
| Mid frequency decoupling using embedded decoupling capacitors P Muthana, M Swaminathan, E Engin, PM Raj, R Tummala IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging …, 2005 | 37 | 2005 |
| First demonstration of 28 GHz and 39 GHz transmission lines and antennas on glass substrates for 5G modules AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017 | 34 | 2017 |
| High density packaging in 2010 and beyond RR Tummala, V Sundaram, F Liu, G White, S Hattacharya, RM Pulugurtha, ... Proceedings of the 4th International Symposium on Electronic Materials and …, 2002 | 31 | 2002 |
| Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging RR Tummala, PM Raj, S Atmur, S Bansal, S Banerji, F Liu, S Bhattacharya, ... Journal of electroceramics 13, 417-422, 2004 | 30 | 2004 |
| Magnetic nanocomposites for organic compatible miniaturized antennas and inductors PM Raj, P Muthana, TD Xiao, L Wan, D Balaraman, IR Abothu, ... Proceedings. International Symposium on Advanced Packaging Materials …, 2005 | 29 | 2005 |
| Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ... IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020 | 28 | 2020 |
Rao TummalaVerified email at ece.gatech.edu
