Pulugurtha Markondeya raj
Pulugurtha Markondeya raj
Florida International University
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The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade
RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ...
IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004
Nanopackaging: Nanotechnologies and electronics packaging
JE Morris
Nanopackaging: Nanotechnologies and Electronics Packaging, 1-44, 2018
Colloidal processing of polymer ceramic nanocomposite integral capacitors
H Windlass, PM Raj, D Balaraman, SK Bhattacharya, RR Tummala
IEEE transactions on electronics packaging manufacturing 26 (2), 100-105, 2003
2005 IEEE 55th Electronic Components and Technology Conference
Institute of Electrical and Electronics Engineers, Inc. Staff
IEEE, 2005
Anisotropic shrinkage in tape‐cast alumina: Role of processing parameters and particle shape
PM Raj, WR Cannon
Journal of the American Ceramic Society 82 (10), 2619-2625, 1999
A review of 5G front-end systems package integration
AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020
Polymer-ceramic nanocomposite capacitors for system-on-package (SOP) applications
H Windlass, PM Raj, D Balaraman, SK Bhattacharya, RR Tummala
IEEE transactions on advanced packaging 26 (1), 10-16, 2003
Anisotropic shrinkage during sintering of particle-oriented systems—numerical simulation and experimental studies
PM Raj, A Odulena, WR Cannon
Acta materialia 50 (10), 2559-2570, 2002
Trend from ICs to 3D ICs to 3D systems
RR Tummala, V Sundaram, R Chatterjee, PM Raj, N Kumbhat, ...
2009 IEEE Custom Integrated Circuits Conference, 439-444, 2009
First demonstration of compact, ultra-thin low-pass and bandpass filters for 5g small-cell applications
M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ...
IEEE Microwave and wireless components letters 28 (12), 1110-1112, 2018
Antenna miniaturization using magneto-dielectric substrates
N Altunyurt, M Swaminathan, PM Raj, V Nair
2009 59th Electronic Components and Technology Conference, 801-808, 2009
Magneto-dielectric nanocomposite for antenna miniaturization and SAR reduction
K Han, M Swaminathan, R Pulugurtha, H Sharma, R Tummala, S Yang, ...
IEEE Antennas and Wireless Propagation Letters 15, 72-75, 2015
Copper interconnections for high performance and fine pitch flip chip digital applications and ultra-miniaturized RF module applications
RR Tummala, PM Raj, A Aggarwal, G Mehrotra, SW Koh, S Bansal, ...
56th Electronic Components and Technology Conference 2006, 10 pp., 2006
Highly-reliable, 30µm pitch copper interconnects using nano-ACF/NCF
N Kumbhat, A Choudhury, M Raine, G Mehrotra, PM Raj, R Zhang, ...
2009 59th Electronic Components and Technology Conference, 1479-1485, 2009
Mid frequency decoupling using embedded decoupling capacitors
P Muthana, M Swaminathan, E Engin, PM Raj, R Tummala
IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging …, 2005
First demonstration of 28 GHz and 39 GHz transmission lines and antennas on glass substrates for 5G modules
AO Watanabe, M Ali, B Tehrani, J Hester, H Matsuura, T Ogawa, PM Raj, ...
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 236-241, 2017
High density packaging in 2010 and beyond
RR Tummala, V Sundaram, F Liu, G White, S Hattacharya, RM Pulugurtha, ...
Proceedings of the 4th International Symposium on Electronic Materials and …, 2002
Fundamental limits of organic packages and boards and the need for novel ceramic boards for next generation electronic packaging
RR Tummala, PM Raj, S Atmur, S Bansal, S Banerji, F Liu, S Bhattacharya, ...
Journal of electroceramics 13, 417-422, 2004
Magnetic nanocomposites for organic compatible miniaturized antennas and inductors
PM Raj, P Muthana, TD Xiao, L Wan, D Balaraman, IR Abothu, ...
Proceedings. International Symposium on Advanced Packaging Materials …, 2005
Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias
AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ...
IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020
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