Andras Poppe
Andras Poppe
BME Elektronikus Eszközök Tanszéke
Verified email at eet.bme.hu - Homepage
Title
Cited by
Cited by
Year
Thermal management for LED applications
CJM Lasance, A Poppe
Springer, 2014
1412014
Thermal investigation of high power optical devices by transient testing
G Farkas, QV Vader, A Poppe, G Bognár
IEEE transactions on Components and Packaging Technologies 28 (1), 45-50, 2005
1402005
Electro-thermal and logi-thermal simulation of VLSI designs
V Székely, A Poppe, A Páhi, A Csendes, G Hajas, M Rencz
IEEE Transactions on Very Large Scale Integration (VLSI) Systems 5 (3), 258-269, 1997
1081997
Electro-thermal simulation: a realization by simultaneous iteration
V Székely, A Poppe, M Rencz, A Csendes, A Páhi
Microelectronics journal 28 (3), 247-262, 1997
71*1997
On the standardization of thermal characterization of LEDs
A Poppe, CJM Lasance
2009 25th Annual IEEE Semiconductor Thermal Measurement and Management …, 2009
692009
Electric and thermal transient effects in high power optical devices
G Farkas, S Haque, F Wall, PS Martin, A Poppe, Q van Voorst Vader, ...
Twentieth Annual IEEE Semiconductor Thermal Measurement and Management …, 2004
692004
Thermal measurement and modeling of multi-die packages
A Poppe, Y Zhang, J Wilson, G Farkas, P Szabó, J Parry, M Rencz, ...
IEEE Transactions on components and packaging technologies 32 (2), 484-492, 2009
672009
THERMAN: a thermal simulation tool for IC chips, microstructures and PW boards
V Székely, A Poppe, M Rencz, M Rosental, T Teszéri
Microelectronics Reliability 40 (3), 517-524, 2000
602000
Multi-domain compact modeling of LEDs: An overview of models and experimental data
A Poppe
Microelectronics Journal 46 (12), 1138-1151, 2015
592015
Multi-domain simulation and measurement of power LED-s and power LED assemblies
A Poppe, G Farkas, V Székely, G Horváth, M Rencz
Twenty-Second Annual IEEE Semiconductor Thermal Measurement and Management …, 2006
592006
Increasing the accuracy of structure function based thermal material parameter measurements
M Rencz, A Poppe, E Kollár, S Ress, V Székely
IEEE Transactions on components and packaging technologies 28 (1), 51-57, 2005
542005
New approaches in the transient thermal measurements
V Székely, S Ress, A Poppe, S Török, D Magyari, Z Benedek, K Torki, ...
Microelectronics Journal 31 (9-10), 727-733, 2000
422000
Dynamic temperature measurements: tools providing a look into package and mount structures
A Poppe, V Székely
Electronics Cooling 8, 10-19, 2002
372002
CAD and Foundries for Microsystems
JM Karam, B Courtois, H Boutamine, P Drake, A Poppe, V Székely, ...
Proceedings of the 34th annual Design Automation Conference, 674-679, 1997
321997
Simulation of LED based luminaires by using multi-domain compact models of LEDs and compact thermal models of their thermal environment
A Poppe
Microelectronics Reliability 72, 65-74, 2017
312017
Nonlinear electro-thermal modeling and field-simulation of OLEDs for lighting applications I: Algorithmic fundamentals
L Pohl, E Kollár, A Poppe, Z Kohári
Microelectronics Journal 43 (9), 624-632, 2012
312012
High-aspect-ratio metal microchannel plates for microelectronic cooling applications
W Yu, MPY Desmulliez, A Drufke, M Leonard, RS Dhariwal, D Flynn, ...
Journal of Micromechanics and Microengineering 20 (2), 025004, 2009
312009
Dynamic compact models of cooling mounts for fast board level design
G Farkas, A Poppe, E Kollár, P Stehouwer
Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2003
302003
Electro-thermal simulation for the prediction of chip operation within the package
M Rencz, V Székely, A Poppe, K Torki, B Courtois
Ninteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 2003
302003
New way for thermal transient testing [IC packaging]
V Székely, M Rencz, A Poppe, B Courtois
Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management …, 1999
301999
The system can't perform the operation now. Try again later.
Articles 1–20