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Rao Tummala
Rao Tummala
Unknown affiliation
Verified email at ece.gatech.edu
Title
Cited by
Cited by
Year
Microelectronics Packaging Handbook: Semiconductor Packaging
RR Tummala, EJ Rymaszewski, AG Klopfenstein
Springer Science & Business Media, 2013
22802013
Fundamentals of microsystems packaging
RR Tummala
McGraw-Hill 2 (01), 190-193, 2001
14882001
Ceramic and glass‐ceramic packaging in the 1990s
RR Tummala
Journal of the American Ceramic Society 74 (5), 895-908, 1991
10381991
ZnO nanobelt/nanowire Schottky diodes formed by dielectrophoresis alignment across Au electrodes
CS Lao, J Liu, P Gao, L Zhang, D Davidovic, R Tummala, ZL Wang
Nano Letters 6 (2), 263-266, 2006
4612006
SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade
RR Tummala
IEEE Transactions on Advanced Packaging 27 (2), 241-249, 2004
3462004
Introduction to System on Package (SOP).
R Tummala, M Swaminathan
McGraw-Hill Professional Publishing, 2007
298*2007
Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates
SK Bhattacharya, RR Tummala
Journal of Materials Science: Materials in Electronics 11, 253-268, 2000
2972000
A review of SiC power module packaging technologies: Challenges, advances, and emerging issues
H Lee, V Smet, R Tummala
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 239-255, 2019
2902019
Wearable systems for health care applications
P Lukowicz, T Kirstein, G Tröster
Methods of information in medicine 43 (03), 232-238, 2004
2902004
RF-system-on-package (SOP) for wireless communications
K Lim, S Pinel, M Davis, A Sutono, CH Lee, D Heo, A Obatoynbo, J Laskar, ...
IEEE Microwave magazine 3 (1), 88-99, 2002
2582002
Low-cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3-D ICs
V Sukumaran, T Bandyopadhyay, V Sundaram, R Tummala
IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (9 …, 2012
2322012
Microelectronics Packaging Handbook: Technology Drivers Part I
RR Tummala, EJ Rymaszewski, AG Klopfenstein
Springer Science & Business Media, 2012
2262012
Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV)
X Liu, Q Chen, P Dixit, R Chatterjee, RR Tummala, SK Sitaraman
2009 59th Electronic components and technology conference, 624-629, 2009
2162009
The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade
RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ...
IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004
1862004
Carrier density and Schottky barrier on the performance of DC nanogenerator
J Liu, P Fei, J Song, X Wang, C Lao, R Tummala, ZL Wang
Nano letters 8 (1), 328-332, 2008
1792008
System on chip or system on package?
RR Tummala, VK Madisetti
IEEE Design & Test of Computers 16 (2), 48-56, 1999
1731999
Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper
AH Kumar, PW McMillan, RR Tummala
US Patent 4,301,324, 1981
1661981
Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors
SK Bhattacharya, RR Tummala
Microelectronics Journal 32 (1), 11-19, 2001
1632001
A novel integrated decoupling capacitor for MCM-L technology
P Chahal, RR Tummala, MG Allen, M Swaminathan
IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998
1611998
A review of 5G front-end systems package integration
AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020
1562020
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