| Microelectronics Packaging Handbook: Technology Drivers Part I RR Tummala, EJ Rymaszewski, AG Klopfenstein Springer Science & Business Media, 2012 | 2305 | 2012 |
| Fundamentals of microsystems packaging RR Tummala McGraw-Hill Education, 2001 | 1386 | 2001 |
| Ceramic and glass‐ceramic packaging in the 1990s RR Tummala Journal of the American Ceramic Society 74 (5), 895-908, 1991 | 1023 | 1991 |
| ZnO nanobelt/nanowire Schottky diodes formed by dielectrophoresis alignment across Au electrodes CS Lao, J Liu, P Gao, L Zhang, D Davidovic, R Tummala, ZL Wang Nano Letters 6 (2), 263-266, 2006 | 448 | 2006 |
| SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade RR Tummala IEEE Transactions on Advanced Packaging 27 (2), 241-249, 2004 | 347 | 2004 |
| Next generation integral passives: materials, processes, and integration of resistors and capacitors on PWB substrates SK Bhattacharya, RR Tummala Journal of Materials Science: Materials in Electronics 11, 253-268, 2000 | 280 | 2000 |
| RF-system-on-package (SOP) for wireless communications K Lim, S Pinel, M Davis, A Sutono, CH Lee, D Heo, A Obatoynbo, J Laskar, ... IEEE Microwave magazine 3 (1), 88-99, 2002 | 260 | 2002 |
| Introduction to System on Package (SOP). R Tummala, M Swaminathan McGraw-Hill Professional Publishing, 2007 | 227 | 2007 |
| Low-cost thin glass interposers as a superior alternative to silicon and organic interposers for packaging of 3-D ICs V Sukumaran, T Bandyopadhyay, V Sundaram, R Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (9 …, 2012 | 215 | 2012 |
| Failure mechanisms and optimum design for electroplated copper through-silicon vias (TSV) X Liu, Q Chen, P Dixit, R Chatterjee, RR Tummala, SK Sitaraman 2009 59th Electronic components and technology conference, 624-629, 2009 | 208 | 2009 |
| A review of SiC power module packaging technologies: Challenges, advances, and emerging issues H Lee, V Smet, R Tummala IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 239-255, 2019 | 186 | 2019 |
| The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ... IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004 | 181 | 2004 |
| System on chip or system on package? RR Tummala, VK Madisetti IEEE Design & Test of Computers 16 (2), 48-56, 1999 | 171 | 1999 |
| Carrier density and Schottky barrier on the performance of DC nanogenerator J Liu, P Fei, J Song, X Wang, C Lao, R Tummala, ZL Wang Nano letters 8 (1), 328-332, 2008 | 166 | 2008 |
| Glass-ceramic structures and sintered multilayer substrates thereof with circuit patterns of gold, silver or copper AH Kumar, PW McMillan, RR Tummala US Patent 4,301,324, 1981 | 162 | 1981 |
| Integral passives for next generation of electronic packaging: application of epoxy/ceramic nanocomposites as integral capacitors SK Bhattacharya, RR Tummala Microelectronics Journal 32 (1), 11-19, 2001 | 159 | 2001 |
| A novel integrated decoupling capacitor for MCM-L technology P Chahal, RR Tummala, MG Allen, M Swaminathan IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 158 | 1998 |
| Multilayered glass-ceramic substrate for mounting of semiconductor device B Narken, RR Tummala US Patent 4,221,047, 1980 | 153 | 1980 |
| Electrical modeling of through silicon and package vias T Bandyopadhyay, R Chatterjee, D Chung, M Swaminathan, R Tummala 2009 IEEE International Conference on 3D System Integration, 1-8, 2009 | 142 | 2009 |
| Through-package-via formation and metallization of glass interposers V Sukumaran, Q Chen, F Liu, N Kumbhat, T Bandyopadhyay, H Chan, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 139 | 2010 |
