| A review of 5G front-end systems package integration AO Watanabe, M Ali, SYB Sayeed, RR Tummala, MR Pulugurtha IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2020 | 156 | 2020 |
| Deformable interconnects with embedded devices in flexible fan-out packages SYB Sayeed, D Wilding, JS Camara, D Vital, S Bhardwaj, PM Raj International Symposium on Microelectronics 2019 (1), 000163-000168, 2019 | 7 | 2019 |
| Tunable multiferroics for reconfigurable RF system packages P Gaire, V Jaiswal, SYB Sayeed, JL Volakis, MR Pulugurtha, S Bhardwaj 2021 IEEE 16th Nanotechnology Materials and Devices Conference (NMDC), 1-4, 2021 | 3 | 2021 |
| Chipscale Piezo-Magnetostrictive Interfaces-A new simplified and microminiaturized telemetry paradigm for Medical Device Packages SYB Sayeed, A Abdal, P Gaire, S Bhardwaj, S Sorushiani, J Volakis, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1219-1225, 2021 | 3 | 2021 |
| Wireless photonic sensors with flex fan-out packaged devices and enhanced power telemetry S Soroushiani, H Nguyen, CR Cercado, A Abdal, C Bolig, SYB Sayeed, ... 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 1550-1556, 2021 | 3 | 2021 |
| 3D heterogeneous and flexible package integration for zero-power wireless neural recording SYB Sayeed, SB Venkatakrishnan, MM Monshi, A Abdulhameed, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 1003-1009, 2020 | 3 | 2020 |
| Miniaturized Fully-Passive Wireless Neural Recording with Heterogeneous Integration in Thin Packages SYB Sayeed, SB Venkatakrishnan, JL Volakis, PM Raj IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | 2 | 2023 |
| Remateable and Deformable Area-Array Interconnects in 3D Smart Wireless Sensor Packages JFS Camara, S Soroushiani, D Wilding, SYB Sayeed, MM Monshi, ... 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 671-676, 2020 | 2 | 2020 |
| Reconfigurable mm Wave Flexible Packages with Ultra-thin Fan-Out Embedded Tunable Ceramic IPDs S Bhardwaj, SKYB Sayeed, JS Camara, D Vital, PM Raj International Symposium on Microelectronics 2019 (1), 000434-000437, 2019 | 2 | 2019 |
| Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications A Hassan, S Soroushiani, A Abdal, SYB Sayeed, WC Lin, MR Pulugurtha IEEE Open Journal of Nanotechnology 3, 52-60, 2022 | 1 | 2022 |
| Wireless Fully-Passive Package-Embedded Seismocardiogram with RF Backscattering SYB Sayeed, HV Navaz, JL Volakis, PM Raj IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023 | | 2023 |
| Passive Impedance-Matched Neural Recording Systems for Improved Signal Sensitivity SYB Sayeed, G Al Duhni, HV Navaz, JL Volakis, MR Pulugurtha Sensors 23 (14), 6441, 2023 | | 2023 |
| Low-Impedance Graphene–PEDOT-PSS Electrodes for Neural Recording and Stimulation in Implantable Medical Devices H Nguyen, J Montes, S Soroushiani, SYB Sayeed, C Moncion, JR Diaz, ... 2021 IEEE 21st International Conference on Nanotechnology (NANO), 327-330, 2021 | | 2021 |
| Design of a Phase Locked Loop by using 50nm CMOS Technology YB Sayeed, S Hossain, A Isa Mahmood | | 2014 |
Pulugurtha Markondeya rajFlorida International UniversityVerified email at ece.gatech.edu
