| Prognostics of ceramic capacitor temperature‐humidity‐bias reliability using Mahalanobis distance analysis L Nie, MH Azarian, M Keimasi, M Pecht Circuit World 33 (3), 21-28, 2007 | 51 | 2007 |
| Regulations and market trends in lead‐free and halogen‐free electronics L Nie, M Pecht, R Ciocci Circuit World 33 (2), 4-9, 2007 | 24 | 2007 |
| Solder ball attachment assessment of reballed plastic ball grid array packages L Nie, M Osterman, F Song, J Lo, SWR Lee, M Pecht IEEE transactions on components and packaging technologies 32 (4), 901-908, 2009 | 17 | 2009 |
| Microstructural analysis of reworked ball grid array assemblies under thermomechanical loading conditions L Nie, M Osterman, MG Pecht IEEE Transactions on Device and Materials Reliability 10 (2), 276-286, 2010 | 3 | 2010 |
| Copper pad dissolution and microstructure analysis of reworked plastic grid array packages in lead-free and mixed assemblies L Nie, M Osterman, M Pecht J. Surf. Mount Technol. 22 (2), 13-20, 2009 | 3 | 2009 |
| Assessing the Impact of Temperature Cycling Reliability of High Levels of Voiding in BGA Solder Joints G Qin, L Nie, F Toth Jr, R Aspandiar, I Williams SMTAI conference, 2012 | 2 | 2012 |
| Microstructural Analysis of Reballed Tin-Lead, Lead-Free, and Mixed Ball Grid Array Assemblies Under Temperature Cycling Test L Nie, M Mueller, M Osterman, M Pecht Journal of electronic materials 39, 1218-1232, 2010 | 2 | 2010 |
| Temperature cycling reliability of reballed and reworked ball grid array packages in SnPb and SAC assembly L Nie | 2 | 2010 |
| Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies L Nie, M Osterman, M Pecht IPC APEX EXPO, 2009 | 2 | 2009 |
| Tin bumping for wafer level lead-free packaging L Nie, J Cai, Z Fang, S Wang, S Jia 2005 6th International Conference on Electronic Packaging Technology, 79-83, 2005 | 2 | 2005 |
| Interfacial reaction of reballed BGAs under isothermal aging conditions L Nie, M Dong, J Cai, M Osterman, M Pecht 2009 International Conference on Electronic Packaging Technology & High …, 2009 | 1 | 2009 |
| A Study of Intermetallic Compounds in Tin Bumps during Multi-Reflows L Nie, J Cai, X Peng, N Zhang, S Wang, S Jia 2006 7th International Conference on Electronic Packaging Technology, 1-4, 2006 | 1 | 2006 |
| Temperature-humidity-bias reliability using Mahalanobis distance analysis Prognostics of ceramic capacitor L Nie, MH Azarian, M Keimasi, M Pecht CIRCUIT WORLD 33 (3), 21-28, 2007 | | 2007 |
