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Rabindra Das
Rabindra Das
Technical Staff, Advanced Technology Division, MIT Lincoln Lab
Verified email at ll.mit.edu
Title
Cited by
Cited by
Year
3D integrated superconducting qubits
D Rosenberg, D Kim, R Das, D Yost, S Gustavsson, D Hover, P Krantz, ...
npj quantum information 3 (1), 42, 2017
1642017
Random laser action in organic–inorganic nanocomposites
D Anglos, A Stassinopoulos, RN Das, G Zacharakis, M Psyllaki, ...
JOSA B 21 (1), 208-213, 2004
1442004
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
RN Das, KI Papathomas, VR Markovich
US Patent 8,063,315, 2011
1362011
Low‐Temperature Preparation of Nanocrystalline Lead Zirconate Titanate and Lead Lanthanum Zirconate Titanate Powders Using Triethanolamine
RN Das, A Pathak, P Pramanik
Journal of the American Ceramic Society 81 (12), 3357-3360, 1998
1161998
Nanocrystalline α‐Al2O3 Using Sucrose
RN Das, A Bandyopadhyay, S Bose
Journal of the American Ceramic Society 84 (10), 2421-2423, 2001
1152001
Analysis and mitigation of interface losses in trenched superconducting coplanar waveguide resonators
G Calusine, A Melville, W Woods, R Das, C Stull, V Bolkhovsky, D Braje, ...
Applied Physics Letters 112 (6), 062601, 2018
1132018
Qubit and coupler circuit structures and coupling techniques
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,134,972, 2018
872018
Method of making a circuitized substrate having at least one capacitor therein
RN Das, FD Egitto, HT Lin, JM Lauffer, VR Markovich
US Patent App. 11/878,673, 2008
662008
Cryogenic electronic packages and assemblies
RN Das, EA Dauler
US Patent 10,586,909, 2020
642020
Solid-state qubits integrated with superconducting through-silicon vias
DRW Yost, ME Schwartz, J Mallek, D Rosenberg, C Stull, JL Yoder, ...
npj Quantum Information 6 (1), 59, 2020
632020
Nanocrystalline ceramics from sucrose process
RN Das
Materials Letters 47 (6), 344-350, 2001
592001
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
RN Das, KI Papathomas, VR Markovich
US Patent App. 13/252,256, 2012
572012
Solution sol–gel processing and investigation of percolation threshold in La2/3Ca1/3MnO3: xSiO2 nanocomposite
D Das, P Chowdhury, RN Das, CM Srivastava, AK Nigam, D Bahadur
Journal of Magnetism and Magnetic Materials 238 (2-3), 178-184, 2002
562002
Conductive metal micro-pillars for enhanced electrical interconnection
RN Das, KI Papathomas, MD Poliks, VR Markovich
US Patent App. 13/082,502, 2012
552012
Chemical synthesis of fine powder of lead magnesium niobate using niobium tartarate complex
RN Das, P Pramanik
Materials Letters 46 (1), 7-14, 2000
522000
Interconnect structures and methods for fabricating interconnect structures
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,121,754, 2018
482018
Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,396,269, 2019
422019
Interconnect structures for assembly of multi-layer semiconductor devices
RN Das, MA Gouker, P Gouker, LM Johnson, RC Johnson
US Patent 9,812,429, 2017
372017
Random lasing from surface modified films of zinc oxide nanoparticles
A Stassinopoulos, RN Das, EP Giannelis, SH Anastasiadis, D Anglos
Applied surface science 247 (1-4), 18-24, 2005
352005
Solid-state qubits: 3D integration and packaging
D Rosenberg, SJ Weber, D Conway, DRW Yost, J Mallek, G Calusine, ...
IEEE Microwave Magazine 21 (8), 72-85, 2020
332020
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