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Rabindra Das
Rabindra Das
Technical Staff, Advanced Technology Division, MIT Lincoln Lab
Verified email at ll.mit.edu
Title
Cited by
Cited by
Year
3D integrated superconducting qubits
D Rosenberg, D Kim, R Das, D Yost, S Gustavsson, D Hover, P Krantz, ...
npj quantum information 3 (1), 42, 2017
2022017
Random laser action in organic–inorganic nanocomposites
D Anglos, A Stassinopoulos, RN Das, G Zacharakis, M Psyllaki, ...
JOSA B 21 (1), 208-213, 2004
1482004
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
RN Das, KI Papathomas, VR Markovich
US Patent 8,063,315, 2011
1422011
Analysis and mitigation of interface losses in trenched superconducting coplanar waveguide resonators
G Calusine, A Melville, W Woods, R Das, C Stull, V Bolkhovsky, D Braje, ...
Applied Physics Letters 112 (6), 2018
1312018
Low‐Temperature Preparation of Nanocrystalline Lead Zirconate Titanate and Lead Lanthanum Zirconate Titanate Powders Using Triethanolamine
RN Das, A Pathak, P Pramanik
Journal of the American Ceramic Society 81 (12), 3357-3360, 1998
1251998
Nanocrystalline α‐Al2O3 Using Sucrose
RN Das, A Bandyopadhyay, S Bose
Journal of the American Ceramic Society 84 (10), 2421-2423, 2001
1122001
Qubit and coupler circuit structures and coupling techniques
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,134,972, 2018
1022018
Solid-state qubits integrated with superconducting through-silicon vias
DRW Yost, ME Schwartz, J Mallek, D Rosenberg, C Stull, JL Yoder, ...
npj Quantum Information 6 (1), 59, 2020
872020
Cryogenic electronic packages and assemblies
RN Das, EA Dauler
US Patent 10,586,909, 2020
842020
Method of making a circuitized substrate having at least one capacitor therein
RN Das, FD Egitto, HT Lin, JM Lauffer, VR Markovich
US Patent App. 11/878,673, 2008
662008
Nanocrystalline ceramics from sucrose process
RN Das
Materials Letters 47 (6), 344-350, 2001
602001
Chemical synthesis of fine powder of lead magnesium niobate using niobium tartarate complex
RN Das, P Pramanik
Materials Letters 46 (1), 7-14, 2000
592000
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate
RN Das, KI Papathomas, VR Markovich
US Patent App. 13/252,256, 2012
572012
Conductive metal micro-pillars for enhanced electrical interconnection
RN Das, KI Papathomas, MD Poliks, VR Markovich
US Patent App. 13/082,502, 2012
552012
Solution sol–gel processing and investigation of percolation threshold in La2/3Ca1/3MnO3: xSiO2 nanocomposite
D Das, P Chowdhury, RN Das, CM Srivastava, AK Nigam, D Bahadur
Journal of Magnetism and Magnetic Materials 238 (2-3), 178-184, 2002
552002
Interconnect structures and methods for fabricating interconnect structures
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,121,754, 2018
532018
Interconnect structures for assembly of multi-layer semiconductor devices
RN Das, MA Gouker, P Gouker, LM Johnson, RC Johnson
US Patent 9,812,429, 2017
502017
Solid-state qubits: 3D integration and packaging
D Rosenberg, SJ Weber, D Conway, DRW Yost, J Mallek, G Calusine, ...
IEEE Microwave Magazine 21 (8), 72-85, 2020
472020
Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
WD Oliver, AJ Kerman, RN Das, DRW Yost, D Rosenberg, MA Gouker
US Patent 10,396,269, 2019
472019
Superconducting integrated circuit
WD Oliver, RN Das, DJ Hover, D Rosenberg, X Miloshi, V Bolkhovsky, ...
US Patent 10,658,424, 2020
402020
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