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Mingzhi Dong
Mingzhi Dong
Verified email at qti.qualcomm.com
Title
Cited by
Cited by
Year
Microstructure and Microwave Dielectric Properties of TiO2‐Doped Zn2SiO4 Ceramics Synthesized Through the Sol–Gel Process
M Dong, Z Yue, H Zhuang, S Meng, L Li
Journal of the American Ceramic Society 91 (12), 3981-3985, 2008
792008
Integrated Virtual Impactor Enabled PM2.5 Sensor
M Dong, E Iervolino, F Santagata, G Zhang, G Zhang
IEEE Sensors Journal 17 (9), 2814-2821, 2017
312017
Silicon microfabrication based particulate matter sensor
M Dong, E Iervolino, F Santagata, G Zhang, G Zhang
Sensors and Actuators A: Physical 247, 115-124, 2016
262016
Thermal analysis of remote phosphor in LED modules
M Dong, J Wei, H Ye, C Yuan, K Zhang
Journal of Semiconductors 34 (5), 053007, 2013
132013
3D system-in-package design using stacked silicon submount technology
M Dong, F Santagata, R Sokolovskij, J Wei, C Yuan, G Zhang
Microelectronics International 32 (2), 63-72, 2015
122015
Phase characterization and dielectric properties of Zn2SiO4 ceramics derived from a sol-gel process
Z Yue, M Dong, S Meng, L Li
Ferroelectrics 387 (1), 184-188, 2009
102009
Effects of nitrogen on wettability and reliability of lead-free solder in reflow soldering
M Dong, Y Wang, J Cai, T Feng, Y Pu
2009 International Conference on Electronic Packaging Technology & High …, 2009
102009
Novel system-in-package design and packaging solution for solid state lighting systems
M Dong, F Santagata, J Wei, C Yuan, G Zhang
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1192-1197, 2014
22014
Interfacial reaction of reballed BGAs under isothermal aging conditions
L Nie, M Dong, J Cai, M Osterman, M Pecht
2009 International Conference on Electronic Packaging Technology & High …, 2009
12009
Solderability of flash gold surface finish
Y Wang, M Dong, J Cai
2009 International Conference on Electronic Packaging Technology & High …, 2009
12009
Thermal analysis for silicon-based integration of LED systems
M Dong, F Santagata, J Wei, C Yuan, K Zhang
2013 10th China International Forum on Solid State Lighting (ChinaSSL), 206-209, 2013
2013
Reliability of lead-free fine pitch BGA under thermal and mechanical impact
M Dong, Q Wang, J Cai, J Li, S Wang
2011 6th International Microsystems, Packaging, Assembly and Circuits …, 2011
2011
Finite Element Method based stress analysis and warpage prediction of SIM card packaging
M Dong, J Cai, Y Chen, Q Wang, X Dou, S Wang
2010 11th International Conference on Electronic Packaging Technology & High …, 2010
2010
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