| Modeling, design, and demonstration of 2.5 D glass interposers for 16-channel 28 Gbps signaling applications B Sawyer, BC Chou, S Gandhi, J Mateosky, V Sundaram, R Tummala 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 2188-2192, 2015 | 20 | 2015 |
| A low-cost approach to high-k thinfilm decoupling capacitors on silicon and glass interposers S Gandhi, S Xiang, PM Raj, V Sundaram, M Swaminathan, R Tummala 2012 IEEE 62nd Electronic Components and Technology Conference, 1356-1360, 2012 | 20 | 2012 |
| Tunable and miniaturized RF components with nanocomposite and nanolayered dielectrics PM Raj, P Chakraborti, H Sharma, KH Han, S Gandhi, S Sitaraman, ... 14th IEEE International Conference on Nanotechnology, 27-31, 2014 | 18 | 2014 |
| A new approach to power integrity with thinfilm capacitors in 3D IPAC functional module S Gandhi, PM Raj, V Sundaram, H Sharma, M Swaminathan, R Tummala 2013 IEEE 63rd Electronic Components and Technology Conference, 1197-1203, 2013 | 17 | 2013 |
| Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips MD Romig, F Stepniak, S Gandhi US Patent 9,572,261, 2017 | 11 | 2017 |
| Novel nanostructured passives for RF and power applications: Nanopackaging with passive components PM Raj, P Chakraborti, D Mishra, H Sharma, S Gandhi, S Sitaraman, ... Nanopackaging: From Nanomaterials to the Atomic Scale: Proceedings of the …, 2015 | 11 | 2015 |
| High- Thin-Film Capacitors With Conducting Oxide Electrodes on Glass Substrates for Power-Supply Applications S Gandhi, MR Pulugurtha, H Sharma, P Chakraborti, RR Tummala IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 9 | 2016 |
| Nanomagnetic structures for inductive coupling and shielding in wireless charging applications D Mishra, S Sitaraman, S Gandhi, S Teng, PM Raj, H Sharma, R Tummala, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 941-945, 2015 | 8 | 2015 |
| 3D IPAC—A new passives and actives concept for ultra-miniaturized electronic and bioelectronic functional modules PM Raj, UM Jow, J Dai, KP Murali, H Sharma, D Mishra, TD Xiao, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 517-522, 2013 | 8 | 2013 |
| Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors S Gandhi, PM Raj, BC Chou, P Chakraborti, MS Kim, S Sitaraman, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 230-235, 2015 | 7 | 2015 |
| Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers G Kumar, PM Raj, J Cho, S Gandhi, P Chakraborti, V Sundaram, J Kim, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 541-547, 2014 | 7 | 2014 |
| Oxide composition studies of electrochemically grown tantalum oxide on sintered tantalum using XPS depth-profiling and co-relation with leakage properties P Chakraborti, H Sharma, MR Pulugurtha, S Gandhi, RR Tummala Journal of Materials Science: Materials in Electronics 28, 18773-18780, 2017 | 6 | 2017 |
| Dielectric–electrode interactions in glass and silicon-compatible thin-film (Ba,Sr)TiO3 capacitors S Gandhi, S Xiang, M Kumar, H Sharma, P Chakraborti, PM Raj, ... Journal of Materials Science: Materials in Electronics 28, 595-600, 2017 | 6 | 2017 |
| Ultrathin, substrate-integrated, and self-healing nanocapacitors with low-leakage currents and high-operating frequencies P Chakraborti, H Sharma, MR Pulugurtha, KP Rataj, C Schnitter, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 6 …, 2016 | 6 | 2016 |
| Packaged semiconductor system having unidirectional connections to discrete components S Gandhi, MD Romig, A Castro US Patent 10,566,276, 2020 | 5 | 2020 |
| 3-D Packaging and Integration of High-Density Tantalum Capacitors on Silicon RG Spurney, H Sharma, PM Raj, R Tummala, N Lollis, M Weaver, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (8 …, 2019 | 5 | 2019 |
| Ultra-high density, thin-film tantalum capacitors with improved frequency characteristics for MHz switching power converters RG Spurney, H Sharma, MR Pulugurtha, R Tummala, N Lollis, M Weaver, ... Journal of Electronic Materials 47, 5632-5639, 2018 | 5 | 2018 |
| High-voltage capacitors for next-generation power modules in electric vehicles RG Spurney, H Sharma, PM Raj, RR Tummala, N Lollis, S Gandhi, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1695-1700, 2017 | 5 | 2017 |
| First demonstration of copper-plated through-package-via (TPV) reliability in ultra-thin 3D glass interposers with double-side component assembly K Demir, S Gandhi, T Ogawa, R Pucha, V Smet, V Sundaram, PM Raj, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 666-671, 2015 | 5 | 2015 |
| Nanowires-based high-density capacitors and thinfilm power sources in ultrathin 3D glass modules S Gandhi, L Li, HY Hui, P Chakraborti, H Sharma, PM Raj, CP Wong, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1492-1497, 2014 | 5 | 2014 |
Parthasarathi ChakrabortiIntel Corporation, Georgia Institute of Technology, North Carolina State UniversityVerified email at gatech.edu
