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Bobi Shi
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Comparative study of surrogate modeling methods for signal integrity and microwave circuit applications
T Nguyen, B Shi, H Ma, EP Li, X Chen, AC Cangellaris, J Schutt-Aine
IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021
222021
Variational inference approach to jitter decomposition in high-speed link
B Shi, T Nguyen, J Schutt-Aine
2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging …, 2020
42020
Statistical Method for Eye Diagram Simulation in a High-Speed Link Nonlinear System
B Shi, Y Zhou, T Nguyen, J Schutt-Aine
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2022
22022
Fast eye diagram simulation based on latency insertion method
Y Zhou, B Shi, Y Zhao, JE Schutt-Ainé
2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2022
22022
Comparative study of machine learning methods for variability analysis in high-speed link
T Nguyen, B Shi, J Schutt-Aine
2021 IEEE 25th Workshop on Signal and Power Integrity (SPI), 1-3, 2021
22021
Channel Inverse Design Using Tandem Neural Network
H Ma, EP Li, Y Wang, B Shi, J Schutt-Aine, A Cangellaris, X Chen
2022 IEEE 26th Workshop on Signal and Power Integrity (SPI), 1-3, 2022
12022
Decision feedback equalizer (DFE) taps estimation with machine learning methods
B Shi, Y Zhao, H Ma, T Nguyen, EP Li, AC Cangellaris, J Schutt-Aine
2021 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2021
12021
Minimum Cursors Selection in Statistical Method for Eye Diagram Simulation in a High-Speed Link Nonlinear System
B Shi, JE Schutt-Aine
2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS), 1-3, 2023
2023
Constrained Gaussian Process for Signal Integrity applications using Variational Inference
T Nguyen, B Shi, H Ma, EP Li, A Cangellaris, J Schutt-Aine
2023 IEEE/MTT-S International Microwave Symposium-IMS 2023, 155-158, 2023
2023
Fast Latency-Insertion-Method-Based Eye Diagram Simulation Incorporating Crosstalk
Y Zhou, B Shi, JE Schutt-Ainé
2023 IEEE 27th Workshop on Signal and Power Integrity (SPI), 1-4, 2023
2023
Characterization of channel simulation method with Jitter and equalization effect on eye diagram
B Shi
University of Illinois at Urbana-Champaign, 2020
2020
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Articles 1–11