| Deep reinforcement learning-based optimal decoupling capacitor design method for silicon interposer-based 2.5-D/3-D ICs H Park, J Park, S Kim, K Cho, D Lho, S Jeong, S Park, G Park, B Sim, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 58 | 2020 |
| Signal integrity design and analysis of silicon interposer for GPU-memory channels in high-bandwidth memory interface K Cho, Y Kim, H Lee, H Kim, S Choi, J Song, S Kim, J Park, S Lee, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 50 | 2018 |
| Low leakage electromagnetic field level and high efficiency using a novel hybrid loop-array design for wireless high power transfer system S Lee, DH Kim, Y Cho, H Kim, C Song, S Jeong, J Song, G Park, S Hong, ... IEEE Transactions on Industrial Electronics 66 (6), 4356-4367, 2018 | 39 | 2018 |
| Signal integrity design and analysis of differential high-speed serial links in silicon interposer with through-silicon via K Cho, Y Kim, H Lee, J Song, J Park, S Lee, S Kim, G Park, K Son, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (1 …, 2018 | 30 | 2018 |
| A 192-Gb 12-high 896-GB/s HBM3 DRAM with a TSV auto-calibration scheme and machine-learning-based layout optimization MJ Park, J Lee, K Cho, J Park, J Moon, SH Lee, TK Kim, S Oh, S Choi, ... IEEE Journal of Solid-State Circuits 58 (1), 256-269, 2022 | 29 | 2022 |
| Design optimization of high bandwidth memory (HBM) interposer considering signal integrity K Cho, H Lee, H Kim, S Choi, Y Kim, J Lim, J Kim, H Kim, Y Kim, Y Kim 2015 IEEE Electrical Design of Advanced Packaging and Systems Symposium …, 2015 | 27 | 2015 |
| Reinforcement learning-based optimal on-board decoupling capacitor design method H Park, J Park, S Kim, D Lho, S Park, G Park, K Cho, J Kim 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 25 | 2018 |
| Design and analysis of power distribution network (PDN) for high bandwidth memory (HBM) interposer in 2.5 D terabyte/s bandwidth graphics module K Cho, Y Kim, H Lee, H Kim, S Choi, S Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 407-412, 2016 | 25 | 2016 |
| Fast and accurate power distribution network modeling of a silicon interposer for 2.5-D/3-D ICs with multiarray TSVs K Cho, Y Kim, S Kim, H Park, J Park, S Lee, D Shim, K Lee, S Oh, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 23 | 2019 |
| Measurement and analysis of glass interposer power distribution network resonance effects on a high-speed through glass via channel Y Kim, J Cho, JJ Kim, K Kim, K Cho, S Kim, S Sitaraman, V Sundaram, ... IEEE Transactions on Electromagnetic Compatibility 58 (6), 1747-1759, 2016 | 20 | 2016 |
| Signal and power integrity design of 2.5 D HBM (High bandwidth memory module) on SI interposer K Cho, H Lee, J Kim 2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-5, 2016 | 18 | 2016 |
| Design and measurement of a novel on-interposer active power distribution network for efficient simultaneous switching noise suppression in 2.5-D/3-D IC S Kim, Y Kim, K Cho, J Song, J Kim IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (2 …, 2018 | 17 | 2018 |
| Electrical performance of high bandwidth memory (HBM) interposer channel in terabyte/s bandwidth graphics module H Lee, K Cho, H Kim, S Choi, J Lim, J Kim 2015 International 3D Systems Integration Conference (3DIC), TS2. 2.1-TS2. 2.4, 2015 | 17 | 2015 |
| Power distribution network (PDN) design and analysis of a single and double-sided high bandwidth memory (HBM) interposer for 2.5 D terabtye/s bandwidth system K Cho, Y Kim, S Kim, H Lee, S Choi, H Kim, J Kim 2016 IEEE International Symposium on Electromagnetic Compatibility (EMC), 96-99, 2016 | 16 | 2016 |
| Signal integrity of bump-less high-speed through silicon via channel for terabyte/s bandwidth 2.5 D IC H Lee, H Kim, S Choi, J Lim, K Cho, Y Jeon, J Shim, H Kim, YJ Kim, J Kim 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2519-2522, 2016 | 16 | 2016 |
| Signal integrity and computing performance analysis of a processing-in-memory of high bandwidth memory (PIM-HBM) scheme S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 14 | 2021 |
| Wideband power/ground noise suppression in low-loss glass interposers using a double-sided electromagnetic bandgap structure Y Kim, G Park, K Cho, PM Raj, RR Tummala, J Kim IEEE Transactions on Microwave Theory and Techniques 68 (12), 5055-5064, 2020 | 14 | 2020 |
| Processing-in-memory in high bandwidth memory (PIM-HBM) architecture with energy-efficient and low latency channels for high bandwidth system S Kim, S Kim, K Cho, T Shin, H Park, D Lho, S Park, K Son, G Park, J Kim 2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging …, 2019 | 14 | 2019 |
| Polynomial model-based eye diagram estimation methods for LFSR-based bit streams in PRBS test and scrambling J Park, S Park, Y Kim, G Park, H Park, D Lho, K Cho, S Lee, DH Kim, ... IEEE Transactions on Electromagnetic Compatibility 61 (6), 1867-1875, 2019 | 14 | 2019 |
| A novel stochastic model-based eye-diagram estimation method for 8B/10B and TMDS-encoded high-speed channels J Park, S Choi, JJ Kim, Y Kim, M Lee, H Kim, B Bae, H Song, K Cho, S Lee, ... IEEE Transactions on Electromagnetic Compatibility 60 (5), 1510-1519, 2017 | 14 | 2017 |
