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Co-authors
Peng WeiGeorge Washington UniversityVerified email at gwu.edu- Yi CaoPurdue UniversityVerified email at purdue.edu
- Alexandre BayenProfessor Electrical Engineering and Computer Science, UC BerkeleyVerified email at berkeley.edu
- Dan DeLaurentisProfessor of Aeronautics and Astronautics, Purdue UniversityVerified email at purdue.edu
- Ahmed ElmahdiPurdue UniversityVerified email at purdue.edu
- Ahmad F. TahaElectrical and Computer Engineering, University of Texas at San AntonioVerified email at utsa.edu
- Xiaoqiang TangTsinghua UniversityVerified email at tsinghua.edu.cn
- Jitesh H. PanchalSchool of Mechanical Engineering, Purdue University, West Lafayette, INVerified email at purdue.edu
- Banavar SridharUSRA@ NASA Ames Research CenterVerified email at nasa.gov
- Jun ChenSan Diego State UniversityVerified email at sdsu.edu
- Lijian ChenUniversity of DaytonVerified email at udayton.edu
- Roberto HOROWITZProfessor of Mechanical Engineering, University of California, BerkeleyVerified email at berkeley.edu
- Venkataramanan BalakrishnanCharles H. Phipps Dean of Engineering, Case Western Reserve UniversityVerified email at case.edu
- Li Jin 金力New York UniversityVerified email at nyu.edu
- Sivakumar RathinamAssociate ProfessorVerified email at tamu.edu
- Claire TomlinUC BerkeleyVerified email at berkeley.edu
- Maryam KamgarpourUniversity of British Columbia, Electrical & ComputerVerified email at ece.ubc.ca
- Wei ZhangProfessor, Department of Mechanical Engineering, Southern University of Science and TechnologyVerified email at sustech.edu.cn
- Shaoshuai MouAssistant Professor at Purdue UniversityVerified email at purdue.edu
- Zhufeng ShaoDepartment of Mechanical Engineering, Tsinghua UniversityVerified email at mail.tsinghua.edu.cn
