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W. Heinz
W. Heinz
Senco R&D
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Title
Cited by
Cited by
Year
High temperature nanoindentation: The state of the art and future challenges
JM Wheeler, DEJ Armstrong, W Heinz, R Schwaiger
Current Opinion in Solid State and Materials Science 19 (6), 354-366, 2015
2112015
Investigation of the fatigue behavior of Al thin films with different microstructure
W Heinz, R Pippan, G Dehm
Materials Science and Engineering: A 527 (29-30), 7757-7763, 2010
462010
Temperature dependent transition of intragranular plastic to intergranular brittle failure in electrodeposited Cu micro-tensile samples
A Wimmer, M Smolka, W Heinz, T Detzel, W Robl, C Motz, V Eyert, ...
Materials Science and Engineering: A 618, 398-405, 2014
422014
Cyclic bending experiments on free-standing Cu micron lines observed by electron backscatter diffraction
A Wimmer, W Heinz, T Detzel, W Robl, M Nellessen, C Kirchlechner, ...
Acta materialia 83, 460-469, 2015
362015
Damage evolution during cyclic tension–tension loading of micron-sized Cu lines
A Wimmer, A Leitner, T Detzel, W Robl, W Heinz, R Pippan, G Dehm
Acta materialia 67, 297-307, 2014
362014
Micro-tension study of miniaturized Cu lines at variable temperatures
A Wimmer, W Heinz, A Leitner, T Detzel, W Robl, C Kirchlechner, G Dehm
Acta Materialia 92, 243-254, 2015
172015
High-temperature characterization of silicon dioxide films with wafer curvature
S Bigl, W Heinz, M Kahn, H Schoenherr, MJ Cordill
Jom 67, 2902-2907, 2015
132015
Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM
B Völker, W Heinz, R Roth, JM Batke, M Cordill, G Dehm
Surface & Coatings Technology, 2015
122015
Interface fracture and chemistry of a tungsten-based metallization on borophosphosilicate glass
B Völker, W Heinz, K Matoy, R Roth, JM Batke, T Schöberl, C Scheu, ...
Philosophical magazine 95 (16-18), 1967-1981, 2015
112015
High cycle fatigue properties of Cu films
T Walter, G Khatibi, M Nelhiebel, W Heinz, W Robl
Microelectronic Engineering 137, 64-69, 2015
112015
Influence of Initial Microstructure on Thermomechanical Fatigue Behavior of Cu Films on Substrates
W Heinz, W Robl, D Gerhard
Microelectronic Engineering, 2014
112014
Grain resolved orientation changes and texture evolution in a thermally strained Al film on Si substrate
W Heinz, G Dehm
Surface and Coatings Technology 206 (7), 1850-1854, 2011
112011
Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass
B Völker, W Heinz, K Matoy, R Roth, JM Batke, T Schöberl, M Cordill, ...
Thin Solid Films, 2015
92015
Following crack path selection in multifilm structures with weak and strong interfaces by in situ 4-point-bending
B Völker, S Venkatesan, W Heinz, K Matoy, R Roth, JM Batke, MJ Cordill, ...
Journal of Materials Research 30, 1-8, 2015
72015
Cyclic deformation behaviour of cu multilayered films on si substrates
T Walter, G Khatibi, M Nelhiebel, W Heinz, W Robl
Materials Science Forum 825, 983-991, 2015
32015
Modeling fatigue life of power semiconductor devices with ε-N fields
O Bluder, K Plankensteiner, M Nelhiebel, W Heinz, C Leitner
Proceedings of the Winter Simulation Conference 2014, 2609-2616, 2014
22014
Constitutive modeling of thin films under thermal cycling
T Pélisset, W Heinz, B Karunamurthy, T Antretter
2013 Eurpoean Microelectronics Packaging Conference (EMPC), 1-5, 2013
22013
Mikrostrukturelle Analyse von thermomechanisch verformten und ermüdeten Al Schichten
W Heinz
Montanuniversität Leoben, Lehrstuhl für Materialphysik, 2010
22010
Haftungssteigerung von PVD-Beschichtungen durch Plasmabehandlung mit gitterlosen Anode-Layer-Source-Ionenquellen
JM Lackner, W Heinz, W Waldhauser, E Brandstatter, M Schwarz
JAHRBUCH OBERFLACHENTECHNIK 63, 114, 2007
12007
Analysis of the interface fracture resistance of multi-layered thin film structures under various service conditions
R Soler, S Venkatesan, W Heinz, R Roth, M Nelhiebel, J Fugger, ...
ESMC2015, 2015
2015
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