| Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength JHL Pang, TH Low, BS Xiong, X Luhua, CC Neo Thin solid films 462, 370-375, 2004 | 265 | 2004 |
| Electromigration induced ductile-to-brittle transition in lead-free solder joints F Ren, JW Nah, KN Tu, B Xiong, L Xu, JHL Pang Applied physics letters 89 (14), 2006 | 146 | 2006 |
| Intermetallic growth studies on Sn-Ag-Cu lead-free solder joints JHL Pang, L Xu, XQ Shi, W Zhou, SL Ngoh Journal of Electronic Materials 33, 1219-1226, 2004 | 142 | 2004 |
| The thermal stability and catalytic performance of Ce-Zr promoted Rh-Pd/γ-Al2O3 automotive catalysts X Wu, L Xu, D Weng Applied Surface Science 221 (1-4), 375-383, 2004 | 131 | 2004 |
| Impact of thermal cycling on Sn-Ag-Cu solder joints and board-level drop reliability L Xu, JHL Pang, F Che Journal of Electronic Materials 37, 880-886, 2008 | 126 | 2008 |
| Nano-indentation characterization of Ni–Cu–Sn IMC layer subject to isothermal aging L Xu, JHL Pang Thin solid films 504 (1-2), 362-366, 2006 | 123 | 2006 |
| Isothermal and thermal cycling aging on IMC growth rate in lead-free and lead-based solder interface L Xu, JHL Pang, KH Prakash, TH Low IEEE Transactions on Components and Packaging Technologies 28 (3), 408-414, 2005 | 122 | 2005 |
| Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins L Xu, P Dixit, J Miao, JHL Pang, X Zhang, KN Tu, R Preisser Applied physics letters 90 (3), 2007 | 112 | 2007 |
| Structure and performance of γ-alumina washcoat deposited by plasma spraying X Wu, D Weng, L Xu, H Li Surface and Coatings Technology 145 (1-3), 226-232, 2001 | 80 | 2001 |
| Effect of intermetallic and Kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint L Xu, JHL Pang 56th Electronic Components and Technology Conference 2006, 8 pp., 2006 | 71 | 2006 |
| Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper L Xu, D Xu, KN Tu, Y Cai, N Wang, P Dixit, JHL Pang, J Miao Journal of Applied Physics 104 (11), 2008 | 70 | 2008 |
| Effect of electromigration-induced back stress gradient on nanoindentation marker movement in SnAgCu solder joints L Xu, JHL Pang, KN Tu Applied physics letters 89 (22), 2006 | 67 | 2006 |
| Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish WH Zhu, L Xu, JHL Pang, XR Zhang, E Poh, YF Sun, AYS Sun, CK Wang, ... 2008 58th Electronic Components and Technology Conference, 1667-1672, 2008 | 62 | 2008 |
| Mechanical and microstructural characterization of high aspect ratio through-wafer electroplated copper interconnects P Dixit, L Xu, J Miao, JHL Pang, R Preisser Journal of Micromechanics and Microengineering 17 (9), 1749, 2007 | 62 | 2007 |
| Nanoindentation on SnAgCu lead-free solder joints and analysis L Xu, JHL Pang Journal of Electronic Materials 35, 2107-2115, 2006 | 62 | 2006 |
| Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column L Xu, JK Han, JJ Liang, KN Tu, YS Lai Applied Physics Letters 92 (26), 2008 | 61 | 2008 |
| Fabrication and characterization of fine pitch on-chip copper interconnects for advanced wafer level packaging by a high aspect ratio through AZ9260 resist electroplating P Dixit, CW Tan, L Xu, N Lin, J Miao, JHL Pang, P Backus, R Preisser Journal of Micromechanics and Microengineering 17 (5), 1078, 2007 | 53 | 2007 |
| Combined thermal and electromigration exposure effect on SnAgCu BGA solder joint reliability L Xu, JHL Pang 56th Electronic Components and Technology Conference 2006, 6 pp., 2006 | 47 | 2006 |
| Lead free solder joint reliability characterization for PBGA, PQFP and TSSOP assemblies FX Che, JHL Pang, BS Xiong, L Xu, TH Low Proceedings Electronic Components and Technology, 2005. ECTC'05., 916-921, 2005 | 46 | 2005 |
| The NO selective reduction on the La1− xSrxMnO3 catalysts X Wu, L Xu, D Weng Catalysis Today 90 (3-4), 199-206, 2004 | 46 | 2004 |
Faxing CheMicron Semiconductor Asia, Singapore在 micron.com 的电子邮件经过验证
