| Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling H Chen, M Mueller, TT Mattila, J Li, X Liu, KJ Wolter, M Paulasto-Kröckel Journal of Materials Research 26 (16), 2103-2116, 2011 | 68 | 2011 |
| High power SiC inverter module packaging solutions for junction temperature over 220°C RPS Woo, Daniel Rhee Min Zhang Hengyun, Susai Lawrence Selvaraj, Sorono ... Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014 | 39* | 2014 |
| Miniaturized double side cooling packaging for high power 3 phase SiC inverter module with junction temperature over 220° C DRM Woo, HH Yuan, JAJ Li, LJ Bum, Z Hengyun 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1190-1196, 2016 | 38 | 2016 |
| Development of bonding process for high density fine pitch micro bump interconnections with wafer level underfill for 3D applications VS Rao, SC Chong, C Zhaohui, JL Aw, EWL Ching, H Gilho, ... Electronics Packaging Technology Conference (EPTC 2013), 543-548, 2013 | 36* | 2013 |
| The effects of concurrent power and vibration loads on the reliability of board-level interconnections in power electronic assemblies JS Karppinen, J Li, M Paulasto-Krockel IEEE Transactions on Device and Materials Reliability 13 (1), 167-176, 2012 | 29 | 2012 |
| Challenges of ultra-thin 5 sides molded WLCSP T Tang, A Lan, J Wu, J Huang, J Tsai, J Li, A Ho, J Chang, WH Lin 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1167-1171, 2016 | 24 | 2016 |
| Microstructural evolution and mechanical properties of Au-20wt.% Sn| Ni interconnection HQ Dong, V Vuorinen, XW Liu, T Laurila, J Li, M Paulasto-Kröckel Journal of Electronic Materials 45, 566-575, 2016 | 18 | 2016 |
| Reliability assessment of a MEMS microphone under shock impact loading J Li, J Makkonen, M Broas, J Hokka, TT Mattila, M Paulasto-Kröckel, ... 2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013 | 17 | 2013 |
| Thermal Compression Bonding of 30um Pitch Cu Pillar Microbump on Organic Substrate with Bare Cu Bondpad KY Au, FX Che, JK Lin, HY Hsiao, X Zhang, S Lim, JL Aw, A Chow 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 936-942, 2016 | 15 | 2016 |
| Thermo-compression bonding assembly process and reliability studies of Cu pillar bump on Cu/low-K chip KY Au, FX Che, JL Aw, JK Lin, B Boehme, F Kuechenmeister 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 574-578, 2014 | 15 | 2014 |
| Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment JS Karppinen, J Li, TT Mattila, M Paulasto-Kröckel Microelectronics Reliability 50 (12), 1994-2000, 2010 | 15 | 2010 |
| Wafer level underfill study for high density ultra-fine pitch Cu-Cu bonding for 3D IC stacking L Xie, S Wickramanayaka, BY Jung, JAJ Li, L Jung-kai, D Ismael Electronics Packaging Technology Conference (EPTC), 2014 IEEE 16th, 2014 | 13 | 2014 |
| Electrical behavior of Au–Ge eutectic solder under aging for solder bump application in high temperature Electronics FL Lau, RI Made, WN Putra, JZ Lim, VC Nachiappan, JL Aw, CL Gan Microelectronics Reliability 53 (9-11), 1581-1586, 2013 | 11 | 2013 |
| Effect of isothermal aging and electromigration on the microstructural evolution of solder interconnections during thermomechanical loading T Laurila, J Karppinen, V Vuorinen, J Li, A Paul, M Paulasto-Kröckel Journal of electronic materials 41, 3179-3195, 2012 | 11 | 2012 |
| Methods for reliability assessment of MEMS devices—Case studies of a MEMS microphone and a 3-axis MEMS gyroscope J Hokka, J Raami, H Hyvönen, M Broas, J Makkonen, J Li, TT Mattila, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 62-69, 2012 | 10 | 2012 |
| Chip to wafer bonding for three-dimensional integration of copper low K Chip by stacking process SC Chong, JL Aw, EWL Ching, DI Cereno, HY Li, SR Vempati, KH Teo Electronics Packaging Technology Conference (EPTC 2013), 250-254, 2013 | 9* | 2013 |
| Process development of multi-die stacking using 20 um pitch micro bumps on large scale dies LJ Bum, JAJ Li, DRM Woo 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 318-321, 2014 | 8 | 2014 |
| Process development of 10μm pitch Cu-Cu low temperature bonding for 3D IC stacking L Xie, S Wickramanayaka, H Li, BY Jung, JL Aw, SC Chong Electronics Packaging Technology Conference (EPTC 2013), 493-497, 2013 | 8 | 2013 |
| 3-D TSV Six-Die Stacking and Reliability Assessment of 20- m-Pitch Bumps on Large-Scale Dies JB Lee, JL Aw, MW Rhee IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (1 …, 2016 | 7 | 2016 |
| Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading T Laurila, J Karppinen, J Li, V Vuorinen, M Paulasto-Kröckel Journal of Materials Science: Materials in Electronics 24, 644-653, 2013 | 7 | 2013 |
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