Guo Qi Zhang
Guo Qi Zhang
Verified email at tudelft.nl - Homepage
Title
Cited by
Cited by
Year
Nanowire-based gas sensors
X Chen, CKY Wong, CA Yuan, G Zhang
Sensors and Actuators B: Chemical 177, 178-195, 2013
3452013
Mechanics of microelectronics
GQ Zhang, WD Van Driel, XJ Fan
Springer Science & Business Media, 2006
2112006
Solid state lighting reliability part 2
WD Van Driel, XJ Fan, GQ Zhang
Springer, 2017
1572017
Solid state lighting reliability part 2
WD Van Driel, XJ Fan, GQ Zhang
Springer, 2017
1572017
A review of small heat pipes for electronics
X Chen, H Ye, X Fan, T Ren, G Zhang
Applied Thermal Engineering 96, 1-17, 2016
1432016
Interfacial delamination mechanisms during soldering reflow with moisture preconditioning
X Fan, GQ Zhang, WD Van Driel, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 252-259, 2008
932008
Thermal management on IGBT power electronic devices and modules
C Qian, AM Gheitaghy, J Fan, H Tang, B Sun, H Ye, G Zhang
IEEE Access 6, 12868-12884, 2018
802018
A micromechanics-based vapor pressure model in electronic packages
XJ Fan, J Zhou, GQ Zhang, LJ Ernst
802005
Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
X Chen, C Yuan, CKY Wong, G Zhang
Journal of molecular modeling 18 (6), 2333-2341, 2012
762012
PoF-simulation-assisted reliability prediction for electrolytic capacitor in LED drivers
B Sun, X Fan, C Qian, G Zhang
IEEE Transactions on Industrial Electronics 63 (11), 6726-6735, 2016
722016
Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang
Optical Materials 35 (3), 504-508, 2013
692013
Driving mechanisms of delamination related reliability problems in exposed pad packages
WD van Driel, MAJ van Gils, X Fan, GQ Zhang, LJ Ernst
IEEE Transactions on Components and Packaging Technologies 31 (2), 260-268, 2008
632008
Prediction and verification of process induced warpage of electronic packages
WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst, F Su, KS Chian, S Yi
Microelectronics Reliability 43 (5), 765-774, 2003
622003
Analysis of Cu/low-k bond pad delamination by using a novel failure index
MAJ Van Gils, O van der Sluis, GQ Zhang, JHJ Janssen, RMJ Voncken
EuroSimE 2005. Proceedings of the 6th International Conference on Thermal …, 2005
612005
Degradation modeling of mid-power white-light LEDs by using Wiener process
J Huang, DS Golubović, S Koh, D Yang, X Li, X Fan, GQ Zhang
Optics express 23 (15), A966-A978, 2015
582015
More than Moore: creating high value micro/nanoelectronics systems
GQ Zhang, A Van Roosmalen
Springer Science & Business Media, 2010
562010
Packaging induced die stresses—Effect of chip anisotropy and time-dependent behavior of a molding compound
WD Van Driel, JHJ Janssen, GQ Zhang, DG Yang, LJ Ernst
J. Electron. Packag. 125 (4), 520-526, 2003
552003
Response surface modeling for nonlinear packaging stresses
WD Van Driel, GQ Zhang, JHJ Janssen, LJ Ernst
J. Electron. Packag. 125 (4), 490-497, 2003
552003
Impact of the functional group on the working range of polyaniline as carbon dioxide sensors
X Chen, CKY Wong, CA Yuan, G Zhang
Sensors and Actuators B: Chemical 175, 15-21, 2012
542012
An accelerated test method of luminous flux depreciation for LED luminaires and lamps
C Qian, XJ Fan, JJ Fan, CA Yuan, GQ Zhang
Reliability Engineering & System Safety 147, 84-92, 2016
532016
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