| Numerical investigation on the melting of nanoparticle-enhanced phase change materials (NEPCM) in a bottom-heated rectangular cavity using lattice Boltzmann method Y Feng, H Li, L Li, L Bu, T Wang International Journal of Heat and Mass Transfer 81, 415-425, 2015 | 146 | 2015 |
| Investigation on die shift issues in the 12-in wafer-level compression molding process L Bu, S Ho, SD Velez, T Chai, X Zhang IEEE Transactions on components, packaging and manufacturing technology 3 …, 2013 | 27 | 2013 |
| Comprehensive investigation of die shift in compression molding process for 12 inch fan-out wafer level packaging Y Han, MZ Ding, B Lin, CS Choong 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 1605-1610, 2016 | 26 | 2016 |
| Model test for water inrush caused by karst caves filled with confined water in tunnels W Yang, X Yang, Z Fang, S Shi, H Wang, L Bu, L Li, Z Zhou Arabian Journal of Geosciences 12, 1-11, 2019 | 23 | 2019 |
| Comprehensive study on the interactions of multiple die shift mechanisms during wafer level molding of multichip-embedded wafer level packages HS Ling, B Lin, CS Choong, SD Velez, CT Chong, X Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 4 (6 …, 2014 | 20 | 2014 |
| Mechanism of Moldable Underfill (MUF) Process for RDL-1^ st Fan-Out Panel Level Packaging (FOPLP) L Bu, FX Che, VS Rao, X Zhang 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1152-1158, 2019 | 18 | 2019 |
| High temperature endurable hermetic sealing material selection and reliability comparison for IR gas sensor module packaging KY Au, DM Zhi, V Chidambaram, B Lin, K Piotr, C KaiLiang 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 1-5, 2016 | 14 | 2016 |
| Prediction for water inrush disaster source and CFD-based design of evacuation routes in karst tunnel S Li, L Bu, S Shi, L Li, Z Zhou International Journal of Geomechanics 22 (5), 05022001, 2022 | 13 | 2022 |
| Numerical simulation of bubble dynamics in microgravity L Pu, H Li, X Lv, J Zhao, T Chen, Y Zhu Microgravity Science and Technology 20, 247-251, 2008 | 12 | 2008 |
| Numerical investigation to influence of perforation angle on hydraulic fracturing process L Bu, S Li, S Shi, X Xie, L Li, Z Zhou Geotechnical and Geological Engineering 37, 1125-1133, 2019 | 11 | 2019 |
| Mechanism of moldable underfill (MUF) process for fan-out wafer level packaging L Bu, FX Che, MZ Ding, SC Chong, XW Zhang 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-7, 2015 | 11 | 2015 |
| Numerical simulation of the water bubble rising in a liquid column using the combination of level set and moving mesh methods in the collocated grids L Bu, J Zhao International journal of thermal sciences 59, 1-8, 2012 | 10 | 2012 |
| Numerical simulation of condensation of bubbles under microgravity conditions by moving mesh method in the double-staggered grid L Pu, H Li, J Zhao, T Chen Microgravity Science and Technology 21, 15-22, 2009 | 9 | 2009 |
| Simultaneous molding and under-filling for void free process to encapsulate fine pitch micro bump interconnections of chip-to-wafer (C2W) bonding in wafer level packaging DV Sorono, SR Vempati, L Bu, SC Chong, CTW Liang, SW Wei 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 67-72, 2013 | 8 | 2013 |
| Design and optimization of wafer-level compression molding process for one chip plus multiple decaps L Bu, S Ho, SD Velez, LB Long, B Jung, T Chai, X Zhang IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (5 …, 2015 | 7 | 2015 |
| MEMS WLCSP development using vertical interconnection BY Jung, C Zhaohui, B Lin, DM Zhi, DZ Peng, CT Chong 2016 IEEE 18th Electronics Packaging Technology Conference (EPTC), 455-458, 2016 | 6 | 2016 |
| Thermal modeling and characterization of SiC power module under both air cooling and liquid cooling conditions H Zhang, HY Hwang, L Bu, JJL Aw, DMW Rhee 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC), 618-623, 2014 | 6 | 2014 |
| Development of high power and high junction temperature SiC based power packages G Tang, LC Wai, TG Lim, YL Ye, PS Ravinder, L Bu, BL Lau, TC Chai, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1419-1425, 2019 | 5 | 2019 |
| High-Performance TO Switches on Compact Cu-Dielectric-Si Hybrid Plasmonic WRRs S Zhu, B Lin, GQ Lo, D Kwong IEEE PHOTONICS TECHNOLOGY LETTERS 26 (24), 2495-2498, 2014 | 5 | 2014 |
| Study on momentum interpolation methods with curvilinear collocated grids in single-phase and two-phase flows L Bu, J Zhao, KJ Tseng Numerical Heat Transfer, Part B: Fundamentals 61 (4), 298-310, 2012 | 5 | 2012 |
