| Emerging Material Technologies for Haptics S Biswas, Y Visell Advanced Materials Technologies, 2019 | 119 | 2019 |
| A Multimodal, Enveloping Soft Gripper: Shape Conformation, Bioinspired Adhesion, and Expansion-Driven Suction Y Hao, S Biswas, E Hawkes, T Wang, M Zhu, L Wen, Y Visell IEEE Transactions on Robotics, 2020 | 87 | 2020 |
| Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix S Biswas, A Schoeberl, Y Hao, J Reiprich, T Stauden, J Pezoldt, ... Nature Communications 10 (4909), 2019 | 80 | 2019 |
| A First Implementation of an Automated Reel‐to‐Reel Fluidic Self‐Assembly Machine SC Park, J Fang, S Biswas, M Mozafari, T Stauden, HO Jacobs Advanced Materials 26 (34), 5942-5949, 2014 | 62 | 2014 |
| Soft, wearable robotics and haptics: Technologies, trends, and emerging applications M Zhu, S Biswas, SI Dinulescu, N Kastor, EW Hawkes, Y Visell Proceedings of the IEEE 110 (2), 246-272, 2022 | 57 | 2022 |
| Haptic Perception, Mechanics, and Material Technologies for Virtual Reality S Biswas, Y Visell Advanced Functional Materials, 2008186, 2021 | 46 | 2021 |
| Millimeter thin and rubber-like solid-state lighting modules fabricated using roll-to-roll fluidic self-assembly and lamination SC Park, S Biswas, J Fang, M Mozafari, T Stauden, HO Jacobs Advanced Materials (Deerfield Beach, Fla.) 27 (24), 3661, 2015 | 31 | 2015 |
| Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries S Biswas, M Mozafari, T Stauden, HO Jacobs Micromachines 7 (4), 2016 | 27 | 2016 |
| Integrated Soft Optoelectronics for Wearable Health Monitoring S Biswas, Y Shao, T Hachisu, T Nguyen‐Dang, Y Visell Advanced Materials Technologies, 2000347, 2020 | 22 | 2020 |
| Approaching roll-to-roll fluidic self-assembly: Relevant parameters, machine design, and applications SC Park, J Fang, S Biswas, M Mozafari, T Stauden, HO Jacobs Journal of Microelectromechanical Systems 24 (6), 1928-1937, 2015 | 21 | 2015 |
| Deformable printed circuit boards that enable metamorphic electronics S Biswas, A Schöberl, M Mozafari, J Pezoldt, T Stauden, HO Jacobs NPG Asia Materials 8 (e336), 2016 | 20 | 2016 |
| 3D Metamorphic Stretchable Microphone Arrays S Biswas, J Reiprich, T Cohrs, DT Arboleda, A Schoeberl, M Mozafari, ... Advanced Materials Technologies, 2017 | 18 | 2017 |
| Biomaterial‐Based Solid‐Electrolyte Organic Electrochemical Transistors for Electronic and Neuromorphic Applications T Nguyen‐Dang, K Harrison, A Lill, A Dixon, E Lewis, J Vollbrecht, ... Advanced Electronic Materials 7 (12), 2100519, 2021 | 15 | 2021 |
| Core–shell transformation-imprinted solder bumps enabling low-temperature fluidic self-assembly and self-alignment of chips and high melting point interconnects M Kaltwasser, U Schmidt, S Biswas, J Reiprich, L Schlag, NA Isaac, ... ACS applied materials & interfaces 10 (47), 40608-40613, 2018 | 14 | 2018 |
| Fluidic self-assembly on electroplated multilayer solder bumps with tailored transformation imprinted melting points M Kaltwasser, U Schmidt, L Lösing, S Biswas, T Stauden, A Bund, ... Scientific reports 9 (1), 11325, 2019 | 13 | 2019 |
| Stress-adaptive meander track for stretchable electronics S Biswas, J Reiprich, J Pezoldt, M Hein, T Stauden, HO Jacobs Flexible and Printed Electronics 3 (3), 032001, 2018 | 12 | 2018 |
| Photoinduced Carbon Tetrabromide Initiated Aerobic Oxidation of Substituted Toluenes to Carboxylic Acids K Zheng, X Yan, G Zhang, X Yan, X Li, X Xu Synlett 31 (03), 272-274, 2020 | 9 | 2020 |
| Efficient fabrication of organic electrochemical transistors via wet chemical processing T Nguyen-Dang, S Chae, K Harrison, LC Llanes, A Yi, HJ Kim, S Biswas, ... ACS Applied Materials & Interfaces 14 (10), 12469-12478, 2022 | 8 | 2022 |
| Metamorphic stretchable touchpad S Biswas, J Reiprich, J Pezoldt, T Stauden, HO Jacobs Advanced Materials Technologies 4 (4), 1800446, 2019 | 5 | 2019 |
| Metamorphic hemispherical microphone array for three-dimensional acoustics S Biswas, J Reiprich, T Cohrs, T Stauden, J Pezoldt, H Jacobs Applied Physics Letters 111 (4), 2017 | 5 | 2017 |
H. O. JacobsETH , Harvard , University of Minnesota, TU IlmenauVerified email at tu-ilmenau.de
