| Ultrathin High-Q 2-D and 3-D RF Inductors in Glass Packages MS Kim, MR Pulugurtha, V Sundaram, RR Tummala, H Yun IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (4 …, 2018 | 25 | 2018 |
| Design and demonstration of ultra-thin glass 3D IPD diplexers Z Wu, J Min, M Kim, MR Pulugurtha, V Sundaram, RR Tummala 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2348-2352, 2016 | 14 | 2016 |
| Modeling, design and demonstration of integrated electromagnetic shielding for miniaturized RF SOP glass packages S Sitaraman, J Min, MR Pulugurtha, MS Kim, V Sundaram, R Tummala 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1956-1960, 2015 | 13 | 2015 |
| Miniaturized and high-performance RF packages with ultra-thin glass substrates MS Kim, MR Pulugurtha, Y Kim, G Park, K Cho, V Smet, V Sundaram, ... Microelectronics Journal 77, 66-72, 2018 | 12 | 2018 |
| Ultra-thin and ultra-small 3D double-side glass power modules with advanced inductors and capacitors S Gandhi, PM Raj, BC Chou, P Chakraborti, MS Kim, S Sitaraman, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 230-235, 2015 | 7 | 2015 |
| Modeling, design and demonstration of ultra-miniaturized glass PA modules with efficient thermal dissipation MS Kim, S Cho, J Min, MR Pulugurtha, N Huang, S Sitaraman, ... 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1163-1167, 2015 | 7 | 2015 |
| Innovative electrical thermal co-design of ultra-high Q TPV-based 3D inductors in glass packages MS Kim, MR Pulugurtha, Z Wu, V Sundaram, R Tummala 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2384-2388, 2016 | 5 | 2016 |
| RF inductors with sputtered nanomagnetic films on glass substrates J Min, M Kim, T Sun, PM Raj, R Tummala Journal of Materials Science: Materials in Electronics 28 (20), 15184-15194, 2017 | 2 | 2017 |
| Design and analysis of receiver channels of glass interposer for dual band Wi-Fi front end module (FEM) G Park, Y Kim, K Cho, J Kim, M Kim, PM Raj, V Sundaram, R Tummala 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal …, 2017 | 1 | 2017 |
| INTEGRATED 3D GLASS MODULES WITH HIGH-Q INDUCTORS AND THERMAL DISSIPATION FOR RF FRONT-END APPLICATIONS MS Kim Georgia Institute of Technology, 2017 | | 2017 |
| For the March 2018 issue, see p. 329 for Table of Contents. For the April 2018 issue, see p. 507 for Table of Contents. Cover art from:“Ultrathin High-Q 2-D and 3-D RF … MS Kim, MR Pulugurtha, V Sundaram, RR Tummala, H Yan | | |
