| A systematic approach to root cause analysis using 3× 5 why’s technique P Gangidi International Journal of Lean Six Sigma 10 (1), 295-310, 2019 | 117 | 2019 |
| Material selection for microelectronic heat sinks: an application of the Ashby approach GP Reddy, N Gupta Materials & Design 31 (1), 113-117, 2010 | 74 | 2010 |
| Novel nanomagnetic materials for high-frequency RF applications PM Raj, H Sharma, GP Reddy, N Altunyurt, M Swaminathan, R Tummala, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1244-1249, 2011 | 26 | 2011 |
| Cobalt–polymer nanocomposite dielectrics for miniaturized antennas PM Raj, H Sharma, GP Reddy, N Altunyurt, M Swaminathan, R Tummala, ... Journal of electronic materials 43, 1097-1106, 2014 | 17 | 2014 |
| Coelectrodeposited solder composite films for advanced thermal interface materials PM Raj, PR Gangidi, N Nataraj, N Kumbhat, GC Jha, R Tummala, N Brese IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (6 …, 2013 | 14 | 2013 |
| Optimal selection of dielectric film in piezoelectric MEMS microphone P Gangidi, N Gupta Microsystem Technologies, 1-9, 2019 | 11 | 2019 |
| Application of Six Sigma in Semiconductor Manufacturing: A Case Study in Yield Improvement PR Gangidi Applications of Design for Manufacturing and Assembly, 2019 | 10 | 2019 |
| Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials GP Reddy, PM Raj, N Nataraj, PM Rajesh, G Jha, A Choudhury, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 7 | 2010 |
Rao TummalaVerified email at ece.gatech.edu
