Prashant Gangidi
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A systematic approach to root cause analysis using 3× 5 why’s technique
P Gangidi
International Journal of Lean Six Sigma 10 (1), 295-310, 2019
Material selection for microelectronic heat sinks: an application of the Ashby approach
GP Reddy, N Gupta
Materials & Design 31 (1), 113-117, 2010
Novel nanomagnetic materials for high-frequency RF applications
PM Raj, H Sharma, GP Reddy, N Altunyurt, M Swaminathan, R Tummala, ...
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1244-1249, 2011
Cobalt–polymer nanocomposite dielectrics for miniaturized antennas
PM Raj, H Sharma, GP Reddy, N Altunyurt, M Swaminathan, R Tummala, ...
Journal of electronic materials 43, 1097-1106, 2014
Coelectrodeposited solder composite films for advanced thermal interface materials
PM Raj, PR Gangidi, N Nataraj, N Kumbhat, GC Jha, R Tummala, N Brese
IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (6 …, 2013
Application of Six Sigma in Semiconductor Manufacturing: A Case Study in Yield Improvement
PR Gangidi
Applications of Design for Manufacturing and Assembly, 2019
Co-electrodeposited graphite and diamond-loaded solder nanocomposites as thermal interface materials
GP Reddy, PM Raj, N Nataraj, PM Rajesh, G Jha, A Choudhury, ...
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
Optimal selection of dielectric film in piezoelectric MEMS microphone
P Gangidi, N Gupta
Microsystem Technologies, 1-9, 2019
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