| High RF performance TSV silicon carrier for high frequency application SW Ho, SW Yoon, Q Zhou, K Pasad, V Kripesh, JH Lau 2008 58th Electronic Components and Technology Conference, 1946-1952, 2008 | 166 | 2008 |
| 3-D packaging with through-silicon via (TSV) for electrical and fluidic interconnections N Khan, LH Yu, TS Pin, SW Ho, V Kripesh, D Pinjala, JH Lau, TK Chuan IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (2 …, 2013 | 93 | 2013 |
| Study of 15µm pitch solder microbumps for 3D IC integration A Yu, JH Lau, SW Ho, A Kumar, WY Hnin, DQ Yu, MC Jong, V Kripesh, ... 2009 59th Electronic Components and Technology Conference, 6-10, 2009 | 87 | 2009 |
| Fabrication of high aspect ratio TSV and assembly with fine-pitch low-cost solder microbump for Si interposer technology with high-density interconnects A Yu, JH Lau, SW Ho, A Kumar, WY Hnin, WS Lee, MC Jong, VN Sekhar, ... IEEE transactions on components, packaging and manufacturing technology 1 (9 …, 2011 | 74 | 2011 |
| Microfabrication and characterization of W-band planar helix slow-wave structure with straight-edge connections C Chua, JM Tsai, S Aditya, M Tang, SW Ho, Z Shen, L Wang IEEE transactions on electron devices 58 (11), 4098-4105, 2011 | 65 | 2011 |
| Solutions strategies for die shift problem in wafer level compression molding G Sharma, A Kumar, VS Rao, SW Ho, V Kripesh IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011 | 64 | 2011 |
| Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps A Yu, JH Lau, SW Ho, A Kumar, HW Yin, JM Ching, V Kripesh, D Pinjala, ... 2009 59th Electronic Components and Technology Conference, 350-354, 2009 | 61 | 2009 |
| Embedded wafer level packaging for 77-GHz automotive radar front-end with through silicon via and its 3-D integration R Li, C Jin, SC Ong, TG Lim, KF Chang, SW Ho IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (9 …, 2013 | 45 | 2013 |
| Application of piezoresistive stress sensors in ultra thin device handling and characterization X Zhang, A Kumar, QX Zhang, YY Ong, SW Ho, CH Khong, V Kripesh, ... Sensors and Actuators A: Physical 156 (1), 2-7, 2009 | 42 | 2009 |
| 77-GHz automotive radar sensor system with antenna integrated package KF Chang, R Li, C Jin, TG Lim, SW Ho, HY Hwang, B Zheng IEEE Transactions on components, packaging and manufacturing technology 4 (2 …, 2013 | 36 | 2013 |
| Development of fine pitch solder microbumps for 3D chip stacking A Yu, A Kumar, SW Ho, HW Yin, JH Lau, KC Houe, SLP Siang, X Zhang, ... 2008 10th Electronics Packaging Technology Conference, 387-392, 2008 | 36 | 2008 |
| Development of coaxial shield via in silicon carrier for high frequency application SW Ho, VS Rao, OKN Khan, SU Yoon, V Kripesh 2006 8th Electronics Packaging Technology Conference, 825-830, 2006 | 33 | 2006 |
| 3D interconnection process development and integration with low stress TSV TT Chua, SW Ho, HY Li, CH Khong, EB Liao, SP Chew, WS Lee, LS Lim, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 24 | 2010 |
| Underfill selection methodology for fine pitch Cu/low-k FCBGA packages X Ong, SW Ho, YY Ong, LC Wai, K Vaidyanathan, YK Lim, D Yeo, ... Microelectronics Reliability 49 (2), 150-162, 2009 | 24 | 2009 |
| Die package and a method for manufacturing the die package V Kripesh, NKO Kalandar, SR Vempati, A Kumar, SW Ho, YLS Lim, ... US Patent App. 12/673,503, 2011 | 21 | 2011 |
| Wafer Level Package and a Method of Forming the Same TG Lim, YY Lim, YM Khoo, NKO Kalandar, F Che, SC Chong, SWD Ho, ... US Patent App. 13/407,295, 2013 | 19 | 2013 |
| Double side redistribution layer process on embedded wafer level package for package on package (PoP) applications SW Ho, FM Daniel, LY Siow, WH SeeToh, WS Lee, SC Chong, ... 2010 12th Electronics Packaging Technology Conference, 383-387, 2010 | 19 | 2010 |
| Numerical modeling of through silicon via (TSV) stacked module with micro bump interconnect for biomedical device CH Khong, X Zhang, N Khan, SW Ho, YY Lim, LC Wai, S Lim, V Kripesh, ... 2010 12th Electronics Packaging Technology Conference, 195-200, 2010 | 16 | 2010 |
| Polymer-based fine pitch Cu RDL to enable cost-effective re-routing for 2.5 D interposer and 3D-IC SW Ho, L Ding, SH Lim, SA Sek, M Yu, GQ Lo 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013), 435-439, 2013 | 14 | 2013 |
| Ultra-Thin FO Package-on-Package for Mobile Application HY Hsiao, SW Ho, SSB Lim, LC Wai, SC Chong, PSS Lim, Y Han, ... 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 21-27, 2019 | 13 | 2019 |
