| Smart manufacturing and intelligent manufacturing: A comparative review B Wang, F Tao, X Fang, C Liu, Y Liu, T Freiheit Engineering 7 (6), 738-757, 2021 | 120 | 2021 |
| Numerical configuration design and investigation of heat transfer enhancement in pipes filled with gradient porous materials B Wang, Y Hong, X Hou, Z Xu, P Wang, X Fang, X Ruan Energy Conversion and Management 105, 206-215, 2015 | 60 | 2015 |
| Development and numerical investigation of novel gradient-porous heat sinks B Wang, Y Hong, L Wang, X Fang, P Wang, Z Xu Energy Conversion and Management 106, 1370-1378, 2015 | 39 | 2015 |
| Gel spinning of UHMWPE fibers with polybutene as a new spin solvent X Fang, T Wyatt, Y Hong, D Yao Polymer Engineering & Science 56 (6), 697-706, 2016 | 33 | 2016 |
| Forecasting potential sensor applications of triboelectric nanogenerators through tech mining H Peng, X Fang, S Ranaei, Z Wen, AL Porter Nano Energy 35, 358-369, 2017 | 27 | 2017 |
| Microstructure and processing performance of brazed diamond drill bits with Ni–Cr+ Cu–Ce composite solder D Duan, L Sun, X Fang, Q Lin, C Li, Z Jiang Diamond and Related Materials 93, 216-223, 2019 | 19 | 2019 |
| High temperature high sensitivity multipoint sensing system based on three cascade Mach–Zehnder interferometers N Zhao, Q Lin, Z Jiang, K Yao, B Tian, X Fang, P Shi, Z Zhang Sensors 18 (8), 2688, 2018 | 19 | 2018 |
| Microstructure and performance of brazed diamonds with Ni–Cr+ multilayer graphene composite alloy D Duan, C Li, L Sun, Y Liu, X Fang, Q Lin, Z Jiang Journal of Alloys and Compounds 816, 152630, 2020 | 17 | 2020 |
| Processing of composite polystyrene foam with a honeycomb structure Y Hong, X Fang, D Yao Polymer Engineering & Science 55 (7), 1494-1503, 2015 | 17 | 2015 |
| An ultra-high pressure sensor based on SOI piezoresistive material Y Zhao, X Fang, Z Jiang, L Zhao Journal of mechanical science and technology 24 (8), 1655-1660, 2010 | 17 | 2010 |
| High speed and low roughness micromachining of silicon carbide by plasma etching aided femtosecond laser processing C Wu, X Fang, F Liu, X Guo, R Maeda, Z Jiang Ceramics International 46 (11), 17896-17902, 2020 | 16 | 2020 |
| Effect of CuCe alloy addition on the microstructure and mechanical performance of brazed diamonds with NiCr alloy D Duan, L Sun, Q Lin, X Fang, C Li, Z Jiang International Journal of Refractory Metals and Hard Materials 80, 253-258, 2019 | 15 | 2019 |
| Research on mechanism of nanoscale cutting with arc trajectory for monocrystalline silicon based on molecular dynamics simulation Q Kang, X Fang, L Sun, J Ding, Z Jiang Computational Materials Science 170, 109175, 2019 | 14 | 2019 |
| Crystal cleavage, periodic nanostructure and surface modification of SiC ablated by femtosecond laser in different media C Wu, X Fang, Q Kang, H Sun, L Zhao, B Tian, Z Fang, M Pan, R Maeda, ... Surface and Coatings Technology 424, 127652, 2021 | 12 | 2021 |
| Hardness and friction coefficient of fused silica under scratching considering elastic recovery X Fang, C Li, L Sun, H Sun, Z Jiang Ceramics International 46 (6), 8200-8208, 2020 | 12 | 2020 |
| Rapid vacuum infusion and curing of epoxy composites with a rubber-cushioned mold design X Fang, C Bi, Y Hong, KH Cho, MS Park, Y Wang, D Yao Polymer-Plastics Technology and Engineering 55 (10), 1030-1038, 2016 | 11 | 2016 |
| Fabrication of high-strength polyoxymethylene fibers by gel spinning X Fang, T Wyatt, J Shi, D Yao Journal of Materials Science 53 (16), 11901-11916, 2018 | 10 | 2018 |
| A 350° C piezoresistive n-type 4H-SiC pressure sensor for hydraulic and pneumatic pressure tests X Fang, C Wu, Y Zhao, Z Jiang, W Rong, Z Feng, Y Lv Journal of Micromechanics and Microengineering 30 (5), 055009, 2020 | 9 | 2020 |
| Microwave processing of syntactic foam from an expandable thermoset/thermoplastic mixture Y Hong, X Fang, D Yao Polymer Engineering & Science 55 (8), 1818-1828, 2015 | 8 | 2015 |
| A high pressure sensor with circular diaphragm based on MEMS technology LB Zhao, XD Fang, YL Zhao, ZD Jiang, Y Li Key Engineering Materials 483, 206-211, 2011 | 8 | 2011 |
Donggang YaoGeorgia Institute of TechnologyVerified email at gatech.edu
