| The SOP for miniaturized, mixed-signal computing, communication, and consumer systems of the next decade RR Tummala, M Swaminathan, MM Tentzeris, J Laskar, GK Chang, ... IEEE Transactions on Advanced Packaging 27 (2), 250-267, 2004 | 186 | 2004 |
| Through-package-via formation and metallization of glass interposers V Sukumaran, Q Chen, F Liu, N Kumbhat, T Bandyopadhyay, H Chan, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 143 | 2010 |
| Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias V Sukumaran, T Bandyopadhyay, Q Chen, N Kumbhat, F Liu, R Pucha, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 583-588, 2011 | 94 | 2011 |
| Chip-last embedded interconnect structures F Liu, N Kumbhat, V Sundaram, RR Tummala US Patent 8,536,695, 2013 | 77 | 2013 |
| Through-package-via (TPV) structures on inorganic interposer and methods for fabricating same V Sundaram, F Liu, R Tummala, V Sukumaran, V Sridharan, Q Chen US Patent 9,275,934, 2016 | 74 | 2016 |
| First demonstration of compact, ultra-thin low-pass and bandpass filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ... IEEE Microwave and Wireless Components Letters 28 (12), 1110-1112, 2018 | 64 | 2018 |
| Design and fabrication of bandpass filters in glass interposer with through-package-vias (TPV) V Sridharan, S Min, V Sundaram, V Sukumaran, S Hwang, H Chan, F Liu, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 60 | 2010 |
| 45 degree polymer micromirror integration for board-level three-dimensional optical interconnects F Wang, F Liu, A Adibi Optics express 17 (13), 10514-10521, 2009 | 58 | 2009 |
| Reliability assessment of microvias in HDI printed circuit boards F Liu, J Lu, V Sundaram, D Sutter, G White, DF Baldwin, RR Tummala IEEE Transactions on Components and Packaging Technologies 25 (2), 254-259, 2002 | 51 | 2002 |
| Next-generation microvia and global wiring technologies for SOP V Sundaram, RR Tummala, F Liu, PA Kohl, J Li, SA Bidstrup-Allen, ... IEEE Transactions on Advanced Packaging 27 (2), 315-325, 2004 | 49 | 2004 |
| Low-cost and low-loss 3D silicon interposer for high bandwidth logic-to-memory interconnections without TSV in the logic IC V Sundaram, Q Chen, Y Suzuki, G Kumar, F Liu, R Tummala 2012 IEEE 62nd Electronic Components and Technology Conference, 292-297, 2012 | 44 | 2012 |
| Single sensor that outputs narrowband multispectral images L Kong, D Yi, S Sprigle, F Wang, C Wang, F Liu, A Adibi, R Tummala Journal of biomedical optics 15 (1), 010502-010502-3, 2010 | 42 | 2010 |
| Design, Modeling, Fabrication and Characterization of 2–5- Redistribution Layer Traces by Advanced Semiadditive Processes on Low-Cost Panel-Based Glass … H Lu, R Furuya, BMD Sawyer, C Nair, F Liu, V Sundaram, RR Tummala IEEE transactions on components, packaging and manufacturing technology 6 (6 …, 2016 | 40 | 2016 |
| Micro impact characterisation of solder joint for drop impact application EH Wong, YW Mai, R Rajoo, KT Tsai, F Liu, SKW Seah, CL Yeh 56th Electronic Components and Technology Conference 2006, 8 pp., 2006 | 40 | 2006 |
| Chip-to-chip optoelectronics SOP on organic boards or packages GK Chang, D Guidotti, F Liu, YJ Chang, Z Huang, V Sundaram, ... IEEE Transactions on Advanced Packaging 27 (2), 386-397, 2004 | 40 | 2004 |
| Chip-last embedded actives and passives in thin organic package for 1–110 GHz multi-band applications F Liu, V Sundaram, S Min, V Sridharan, H Chan, N Kumbhat, BW Lee, ... 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010 | 36 | 2010 |
| Through package via structures in panel-based silicon substrates and methods of making the same VV Sundaram, F Liu, RR Tummala, Q Chen US Patent App. 13/448,064, 2012 | 35 | 2012 |
| Miniaturized high-performance filters for 5G small-cell applications M Ali, F Liu, A Watanabe, PM Raj, V Sundaram, MM Tentzeris, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1068-1075, 2018 | 33 | 2018 |
| Design of embedded high Q-inductors in MCM-L technology S Dalmia, W Kim, SH Min, M Swaminathan, V Sundaraman, F Liu, ... 2001 IEEE MTT-S International Microwave Sympsoium Digest (Cat. No. 01CH37157 …, 2001 | 33 | 2001 |
| 2.5 D glass panel embedded (GPE) packages with better I/O density, performance, cost and reliability than current silicon interposers and high-density fan-out packages S Ravichandran, S Yamada, G Park, HW Chen, T Shi, C Buch, F Liu, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 625-630, 2018 | 32 | 2018 |
Pulugurtha Markondeya rajFlorida International UniversityVerified email at ece.gatech.edu
