Ruhan E. Ustad

202320246 14

Vijay Dinkar ChavanNano Device Laboratory, Department of Electronic Engineering, Sejong University, Seoul, South KoreaVerified email at sju.ac.kr
Dr. Tukaram D. DongaleShivaji University, KolhapurVerified email at unishivaji.ac.in
Deok-kee KimSejong UniversityVerified email at sejong.ac.kr
Sarita PatilSanjay Ghodawat University, KolhapurVerified email at sanjayghodawatuniversity.ac.in
ZULFQAR ALI SHEIKHResearcher at NDLab SejongVerified email at sju.ac.kr
Swapnil R. PatilPhD Scholar Jeju National University, Republic of Korea.Verified email at stu.jejunu.ac.kr
Rakesh KulkarniPhD. student ,Department of Environmental Engineering, Kwangwoon UniversityVerified email at kw.ac.kr
Dr. Somnath S. KundaleSchool of Nanoscience and Technology, Shivaji University Kolhapur

Ruhan E. Ustad

Semiconductor Systems Engineering, Sejong University, Seoul.

Verified email at sju.ac.kr


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Recent progress in energy, environment, and electronic applications of MXene nanomaterials RE Ustad, SS Kundale, KA Rokade, SL Patil, VD Chavan, KD Kadam, ... Nanoscale 15 (23), 9891-9926, 2023	17	2023
Transformation of rust iron into a sustainable product for applications in the electronic, energy, biomedical, and environment fields: Towards a multitasking approach VD Chavan, J Aziz, H Kim, SR Patil, RE Ustad, ZA Sheikh, CS Patil, ... Nano Today 54, 102085, 2024	2	2024
Artificial synaptic characteristics of PVA: ZnO nanocomposite memristive devices R Kumari, J Gellanki, SS Kundale, RE Ustad, TD Dongale, Y Fu, ... APL Materials 11 (10), 2023	1	2023
Advanced functional materials and their coordinated composites for next-generation Li-S batteries: A brief review VD Chavan, PD Patil, CS Patil, SR Patil, PK Katkar, ZA Sheikh, RE Ustad, ... Journal of Energy Storage 88, 111572, 2024		2024
Tailoring hybrid CrCoSb-B nano-needles via Ar plasma: A path to sustainable water splitting and urea oxidation R Kulkarni, LP Lingamdinne, ZA Sheikh, VD Chavan, RE Ustad, SR Patil, ... Chemical Engineering Journal 486, 150352, 2024		2024
Thermal, Mechanical, and Electrical Stability of Cu Films in an Integration Process with Photosensitive Polyimide (PSPI) Films RE Ustad, VD Chavan, H Kim, M Shin, SK Kim, KK Choi, D Kim Nanomaterials 13 (19), 2642, 2023		2023

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