RenÚ Poelma
RenÚ Poelma
Department of Microelectronics, Delft University of Technology
Verified email at - Homepage
Cited by
Cited by
Tailoring the mechanical properties of high‐aspect‐ratio carbon nanotube arrays using amorphous silicon carbide coatings
RH Poelma, B Morana, S Vollebregt, E Schlangen, HW van Zeijl, X Fan, ...
Advanced Functional Materials 24 (36), 5737-5744, 2014
An automated hybrid bioelectronic system for autogenous restoration of sinus rhythm in atrial fibrillation
ECA Nyns, RH Poelma, L Volkers, JJ Plomp, CI Bart, AM Kip, ...
Science translational medicine 11 (481), eaau6447, 2019
Effects of single vacancy defect position on the stability of carbon nanotubes
RH Poelma, H Sadeghian, S Koh, GQ Zhang
Microelectronics Reliability 52 (7), 1279-1284, 2012
A numerical experimental approach for characterizing the elastic properties of thin films: application of nanocantilevers
RH Poelma, H Sadeghian, SPM Noijen, JJM Zaal, GQ Zhang
Journal of Micromechanics and Microengineering 21 (6), 065003, 2011
Effects of nanostructure and coating on the mechanics of carbon nanotube arrays
RH Poelma, X Fan, ZY Hu, G Van Tendeloo, HW van Zeijl, GQ Zhang
Advanced Functional Materials 26 (8), 1233-1242, 2016
Thermal characterization of carbon nanotube foam using MEMS microhotplates and thermographic analysis
C Silvestri, M Riccio, RH Poelma, B Morana, S Vollebregt, F Santagata, ...
Nanoscale 8 (15), 8266-8275, 2016
High-resolution MEMS inertial sensor combining large-displacement buckling behaviour with integrated capacitive readout
B El Mansouri, LM Middelburg, RH Poelma, GQ Zhang, HW van Zeijl, ...
Microsystems & nanoengineering 5 (1), 60, 2019
Stretchable binary Fresnel lens for focus tuning
X Li, L Wei, RH Poelma, S Vollebregt, J Wei, HP Urbach, PM Sarro, ...
Scientific Reports 6 (1), 1-8, 2016
Effects of conformal nanoscale coatings on thermal performance of vertically aligned carbon nanotubes
C Silvestri, M Riccio, RH Poelma, A Jovic, B Morana, S Vollebregt, A Irace, ...
Small 14 (20), 1800614, 2018
3D interconnect technology based on low temperature copper nanoparticle sintering
B Zhang, YCP Carisey, A Damian, RH Poelma, GQ Zhang, HW van Zeijl
2016 17th International Conference on Electronic Packaging Technology (ICEPTá…, 2016
Tunable binary fresnel lens based on stretchable pdms/cnt composite
X Li, L Wei, S Vollebregt, R Poelma, Y Shen, J Wei, P Urbach, PM Sarro, ...
2015 Transducers-2015 18th International Conference on Solid-State Sensorsá…, 2015
Multi-LED package design, fabrication and thermal analysis
RH Poelma, S Tarashioon, HW van Zeijl, S Goldbach, JLJ Zijl, GQ Zhang
Journal of Semiconductors 34 (5), 054002, 2013
Metallic nanoparticle based interconnect for heterogeneous 3D integration
HW Van Zeijl, Y Carisey, A Damian, RH Poelma, A Zinn, CQ Zhang
2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 217-224, 2016
Mechanical characterization of individual polycrystalline carbon tubes for use in electrical nano-interconnects
A Khiat, RH Poelma, GQ Zhang, F Heuck, FD Tichelaar, M Sarno, ...
Microelectronic engineering 98, 317-320, 2012
Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip
H Yi, E Ozturk, M Koelink, J Krimmling, AA Damian, W Debski, ...
IEEE Transactions on Components, Packaging and Manufacturing Technology 12á…, 2022
Optical ventricular cardioversion by local optogenetic targeting and LED implantation in a cardiomyopathic rat model
ECA Nyns, T Jin, MS Fontes, T van den Heuvel, V Portero, C Ramsey, ...
Cardiovascular research 118 (10), 2293-2303, 2022
Establishment of the coarse grained parameters for epoxy-copper interfacial separation
CKY Wong, SYY Leung, RH Poelma, KMB Jansen, CCA Yuan, ...
Journal of Applied Physics 111 (9), 094906, 2012
Vertically-aligned multi-walled carbon nano tube pillars with various diameters under compression: pristine and NbTiN coated
A Mirza Gheitaghy, RH Poelma, L Sacco, S Vollebregt, GQ Zhang
Nanomaterials 10 (6), 1189, 2020
Through-polymer-via for 3D heterogeneous integration and packaging
J Hamelink, RH Poelma, M Kengen
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-7, 2015
Through-polymer via (TPV) and method to manufacture such a via
RH Poelma, H Van Zeijl, G Zhang
WO 2014107108 (A1), 2014
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