Aulis Tuominen
Aulis Tuominen
Salo, Finland
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Hydrogen sensor of Pd-decorated tubular TiO2 layer prepared by anodization with patterned electrodes on SiO2/Si substrate
J Moon, HP Hedman, M Kemell, A Tuominen, R Punkkinen
Sensors and Actuators B: Chemical 222, 190-197, 2016
Thermal analysis of LED spot lighting device operating in external natural or forced heat convection
M Maaspuro, A Tuominen
Microelectronics Reliability 53 (3), 428-434, 2013
Analyzing the Direct Methanol Fuel Cell technology in portable applications by a historical and bibliometric analysis.
A Suominen, A Tuominen
Journal of Business Chemistry 7 (3), 2010
Reliability of 80 μm pitch flip chip attachment on flex
P Palm, J Määttänen, A Tuominen, E Ristolainen
Microelectronics reliability 41 (5), 633-638, 2001
Reviewing and defining productization
A Suominen, J Kantola, A Tuominen
20th Annual Conference of the International Society for Professional …, 2009
Gas sensor using anodic TiO2 thin film for monitoring hydrogen
J Moon, M Kemell, J Kukkola, R Punkkinen, HP Hedman, A Suominen, ...
Procedia Engineering 47, 791-794, 2012
Discussion on the challenges of DMFC catalyst loading process for mass production
W Zheng, A Suominen, A Tuominen
Energy Procedia 28, 78-87, 2012
A study of monitoring hydrogen using mesoporous TiO2 synthesized by anodization
J Moon, HP Hedman, M Kemell, A Suominen, E Mäkilä, H Kim, ...
Sensors and Actuators B: Chemical 189, 246-250, 2013
The applicability of electrodeposited photoresists in producing ultra‐fine lines using sputtered seeding layers
P Jalonen, A Tuominen
Circuit World, 2002
Analyzing prospects of portable fuel cells with an expert opinion study
A Suominen, A Tuominen, J Kantola
Futures 43 (5), 513-524, 2011
The correlation between the interference colour and growth procedure of anodic titanium dioxide nanotube arrays
J Moon, M Kemell, B Park, A Suominen, E Mäkilä, R Punkkinen, ...
Coloration Technology 130 (1), 1-7, 2014
Qualification of flip chip fluxes by wetting balance and surface insulation resistance tests
A Tuominen, E Ristolainen, V Lehtinen
Soldering & surface mount technology, 1999
A new structure of a passive direct methanol fuel cell
W Zheng, A Suominen, J Kankaanranta, A Tuominen
Chemical engineering science 76, 188-191, 2012
Characterization of resolution cycle times of corrective actions in mobile terminals
A Mwegerano, P Kytösaho, T Liukkonen, A Tuominen
Quality and Reliability Engineering International 24 (5), 613-621, 2008
A case study of spc in circuit board assembly: statistical mounting process control
T Liukkonen, A Tuominen
2004 24th International Conference on Microelectronics (IEEE Cat. No …, 2004
The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow
T Liukkonen, P Nummenpää, A Tuominen
Soldering & surface mount technology, 2004
Metallization of microvias by sputter-deposition
T Uusluoto, P Jalonen, H Laaksonen, A Tuominen
Microelectronics Reliability 44 (4), 587-593, 2004
Applicability of no-flow fluxing encapsulants and flip chip technology in volume production
P Palm, K Puhakka, J Maattanen, T Heimonen, A Tuominen
4th International Conference on Adhesive Joining and Coating Technology in …, 2000
The effect of sputtered interface metallic layers on reinforced core laminate making build-up structures
P Jalonen, A Tuominen
Microelectronics Reliability 42 (7), 1075-1079, 2002
Decreasing variation in paste printing using statistical process control
T Liukkonen, A Tuominen
Microelectronics reliability 43 (7), 1157-1161, 2003
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