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Kaspar Jansen
Kaspar Jansen
Full professor TU Delft
Verified email at tudelft.nl
Title
Cited by
Cited by
Year
Effect of processing conditions on shrinkage in injection molding
KMB Jansen, DJ Van Dijk, MH Husselman
Polymer Engineering & Science 38 (5), 838-846, 1998
2391998
Fabrication factors influencing mechanical, moisture-and water-related properties of mycelium-based composites
FVW Appels, S Camere, M Montalti, E Karana, KMB Jansen, ...
Materials & Design 161, 64-71, 2019
2132019
Effect of pressure history on shrinkage and residual stresses—injection molding with constrained shrinkage
KMB Jansen, G Titomanlio
Polymer Engineering & Science 36 (15), 2029-2040, 1996
1631996
Droplet breakup in concentrated emulsions
KMB Jansen, WGM Agterof, J Mellema
Journal of rheology 45 (1), 227-236, 2001
1422001
In‐mold shrinkage and stress prediction in injection molding
G Titomanlio, KMB Jansen
Polymer Engineering & Science 36 (15), 2041-2049, 1996
1251996
Construction of fast‐response heating elements for injection molding applications
KMB Jansen, AAM Flaman
Polymer Engineering & Science 34 (11), 894-897, 1994
1031994
As‐molded shrinkage measurements on polystyrene injection molded products
KMB Jansen, R Pantani, G Titomanlio
Polymer Engineering & Science 38 (2), 254-264, 1998
991998
Heat transfer in injection moulding systems with insulation layers and heating elements
KMB Jansen
International Journal of heat and mass transfer 38 (2), 309-316, 1995
941995
Hydrophobin gene deletion and environmental growth conditions impact mechanical properties of mycelium by affecting the density of the material
FVW Appels, J Dijksterhuis, CE Lukasiewicz, KMB Jansen, HAB Wösten, ...
Scientific reports 8 (1), 4703, 2018
832018
Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, M Boutelje, GQ Zhang
Optical Materials 35 (3), 504-508, 2013
832013
Closed form expression for residual stresses and warpage during cure of composite laminates
M Abouhamzeh, J Sinke, KMB Jansen, R Benedictus
Composite Structures 133, 902-910, 2015
682015
Characterization and modeling the thermo-mechanical cure-dependent properties of epoxy molding compound
M Sadeghinia, KMB Jansen, LJ Ernst
International Journal of Adhesion and Adhesives 32, 82-88, 2012
682012
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products
MY Mehr, WD Van Driel, KMB Jansen, P Deeben, GQ Zhang
Microelectronics Reliability 54 (1), 138-142, 2014
562014
Numerical modeling of warpage induced in QFN array molding process
DG Yang, KMB Jansen, LJ Ernst, GQ Zhang, WD Van Driel, HJL Bressers, ...
Microelectronics Reliability 47 (2-3), 310-318, 2007
522007
Constitutive modeling of moulding compounds [electronic packaging applications]
KMB Jansen, L Wang, DG Yang, C Van't Hof, LJ Ernst, HJL Bressers, ...
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
522004
Prediction of process-induced warpage of IC packages encapsulated with thermosetting polymers
DG Yang, KMB Jansen, LJ Ernst, GQ Zhang, WD Van Driel, HJL Bressers, ...
2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004
512004
Characterization of the viscoelastic properties of an epoxy molding compound during cure
M Sadeghinia, KMB Jansen, LJ Ernst
Microelectronics Reliability 52 (8), 1711-1718, 2012
492012
Correlation between chemistry of polymer building blocks and microelectronics reliability
HJL Bressers, WD van Driel, KMB Jansen, LJ Ernst, GQ Zhang
Microelectronics Reliability 47 (2-3), 290-294, 2007
492007
Time-and temperature-dependent thermo-mechanical modeling of a packaging molding compound and its effect on packaging process stresses
LJ Ernst, GQ Zhang, KMB Jansen, HJL Bressers
J. Electron. Packag. 125 (4), 539-548, 2003
482003
The influence of surface heating on the birefringence distribution in injection molded parts
KMB Jansen, AAM Flaman
Polymer Engineering & Science 34 (11), 898-904, 1994
481994
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