| System and method for performing electrical impedance tomography S Mahalingam, MKK Meethal, P Sharma, RVVL Langoju, W Basu, ... US Patent 8,508,238, 2013 | 57 | 2013 |
| Modeling spatial strain gradient effects in thermo-mechanical fatigue of copper microstructures RV Pucha, G Ramakrishna, S Mahalingam, SK Sitaraman International Journal of Fatigue 26 (9), 947-957, 2004 | 20 | 2004 |
| Transducer configurations and methods for transducer positioning in electrical impedance tomography W Basu, MKK Meethal, S Mahalingam, RVVL Langoju, P Ghoshal US Patent 8,963,562, 2015 | 19 | 2015 |
| Electrical network representation of a distributed system S Mahalingam, MKK Meethal, A Banerjee, W Basu, HK Pillai US Patent 8,264,246, 2012 | 19 | 2012 |
| Study of interfacial crack propagation in flip chip assemblies with nano-filled underfill materials S Mahalingam Georgia Institute of Technology, 2005 | 15 | 2005 |
| System and method for monitoring a subsea well PT Sipilä, NJ Ellson, DJ Buttle, JC McCarthy, S Mahalingam US Patent 9,249,657, 2016 | 12 | 2016 |
| Energy storage device and associated method S Mahalingam, L Salasoo, KW Browall, AW Kane, A Devarajan US Patent 8,765,275, 2014 | 8 | 2014 |
| Experimental characterization of monotonic and fatigue delamination of novel underfill materials S Mahalingam, K Goray, S Tonapi, SK Sitaraman | 8 | 2006 |
| System-level reliability assessment of mixed-signal convergent microsystems RV Pucha, S Hegde, M Damani, K Tunga, A Perkins, S Mahalingam, ... IEEE transactions on advanced packaging 27 (2), 438-452, 2004 | 8 | 2004 |
| Systems and methods for monitoring electrical contacts S Mahalingam, M Valdes, T Asokan, AM May US Patent App. 13/273,685, 2013 | 7 | 2013 |
| Electrical network analysis of a multiphase system S Mahalingam, A Banerjee, W Basu, HK Pillai US Patent 8,121,804, 2012 | 6 | 2012 |
| Design of underfill materials for lead free flip chip applications S Mahalingam, K Goray, A Joshi The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena …, 2004 | 6 | 2004 |
| Material interaction effects in the reliability of high density interconnect (HDI) boards S Mahalingam, S Hegde, G Ramakrishna, RV Pucha, SK Sitaraman ASME International Mechanical Engineering Congress and Exposition 37149, 165-170, 2003 | 6 | 2003 |
| System and method for soft-field reconstruction RVVL Langoju, W Basu, MKK Meethal, S Mahalingam US Patent 8,892,379, 2014 | 5 | 2014 |
| Theoretical Modeling and Prediction of Delamination in Flip Chip Assemblies With Nanofilled No-Flow Underfill Materials S Mahalingam, A Prabhakumar, S Tonapi, SK Sitaraman | 4 | 2008 |
| System and method for excitation generation in soft-field tomography AS Ross, S Mahalingam, A Tiwari, SR Panicker, MKK Meethal US Patent App. 13/179,179, 2013 | 3 | 2013 |
| Design-for-Reliability Tools for Highlyintegrated System-on-Package Technology RV Pucha, S Hegde, M Damani, KJ Leee, K Tunga, A Perkins, ... 2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007 | 3 | 2007 |
| Materials, processes and reliability of mixed-signal substrates for SOP technology S Mahalingam, S Hegde, J Ahmad, RV Pucha, V Sundaram, F Liu, ... 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE …, 2004 | 3 | 2004 |
| Fluxing for flip chip assembly-effect of bump damage S Mahalingam, JH Mun, A Prats, D Blass, K Srihari Advances in Electronic Materials and Packaging 2001 (Cat. No. 01EX506), 135-138, 2001 | 3 | 2001 |
| Using “Digital Twin” Of Coriolis Meters For Multiphase Flow Measurement S Mahalingam, M Arsalan Offshore Technology Conference, D021S018R003, 2020 | 2 | 2020 |
