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- Xuefeng WangTsinghua UniversityVerified email at mails.tsinghua.edu.cn
- Wentian MiUC BerkeleyVerified email at berkeley.edu
- Han WangUniversity of Hong KongVerified email at hku.hk
- Qianyi XieApplied Materials Inc.Verified email at amat.com
- Ya-Long CuiPh.D. Candidate of Microelectronics, Tsinghua UniversityVerified email at mails.tsinghua.edu.cn
- Yufeng WangElectrical Engineering, University of Southern CaliforniaVerified email at usc.edu
- Fengnian XiaBarton L. Weller Associate Professor in Engineering and Science, Yale UniversityVerified email at yale.edu
- Hongwei ZhuTsinghua UniversityVerified email at tsinghua.edu.cn
- Yuxuan Cosmi LinTexas A&M UniversityVerified email at tamu.edu
- Qiushi GuoAssistant Professor, CUNY Advanced Science Research CenterVerified email at gc.cuny.edu
- Hong-Yu (Henry) ChenGigaDevice Semiconductor Inc.Verified email at gigadevice.com
- H.-S. Philip WongProfessor of Electrical Engineering, Stanford UniversityVerified email at stanford.edu
- Huan ZhaoWigner Distinguished Staff Fellow, Oak Ridge National LaboratoryVerified email at ornl.gov
- judy j. chaProfessor, Materials Science and Engineering, Cornell UniversityVerified email at cornell.edu
- Xiaomu WangSchool of Electronic Science and Engineering, Nanjing UniversityVerified email at nju.edu.cn
- Yuegang ZhangSuzhou Institute of Nano-Tech and Nano-BionicsVerified email at tsinghua.edu.cn
- Po-Wen ChiuDepartment of Electrical Engineering, Nation Tsing Hua UniversityVerified email at ee.nthu.edu.tw
- Xinming LiTHU, MIT, NCNST, CUHK, PolyU, NIMS, South China Normal UniverstiyVerified email at m.scnu.edu.cn
- Shimeng YuGeorgia Institute of Technology, Professor of ECEVerified email at ece.gatech.edu
- Hao RenArizona State University and Shanghaitech UniversityVerified email at asu.edu