| Warpage and thermal characterization of fan-out wafer-level packaging JH Lau, M Li, D Tian, N Fan, E Kuah, W Kai, M Li, J Hao, YM Cheung, Z Li, ... IEEE transactions on components, packaging and manufacturing technology 7 …, 2017 | 155 | 2017 |
| Design, materials, process, fabrication, and reliability of fan-out wafer-level packaging JH Lau, M Li, QM Li, I Xu, T Chen, Z Li, KH Tan, QX Yong, Z Cheng, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (6 …, 2018 | 92 | 2018 |
| Fan-out wafer-level packaging for heterogeneous integration JH Lau, M Li, ML Qingqian, T Chen, I Xu, QX Yong, Z Cheng, N Fan, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 90 | 2018 |
| Optical nonlinearities of tea studied by Z-scan and four-wave mixing techniques YM Cheung, SK Gayen JOSA B 11 (4), 636-643, 1994 | 76 | 1994 |
| Excited-state absorption in Pr 3+: Y 3 Al 5 O 12 YM Cheung, SK Gayen Physical Review B 49 (21), 14827, 1994 | 74 | 1994 |
| Chip-first fan-out panel-level packaging for heterogeneous integration CT Ko, H Yang, JH Lau, M Li, M Li, C Lin, JW Lin, T Chen, I Xu, CL Chang, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 8 (9 …, 2018 | 62 | 2018 |
| Thermal compression bonding of semiconductor chips YM Cheung, TYP Lo, M Li, YH Mak, K San LAM US Patent 8,967,452, 2015 | 52 | 2015 |
| Two-photon excitation of the lowest 4→4f5d near-ultraviolet transitions in : SK Gayen, BQ Xie, YM Cheung Physical review B 45 (1), 20, 1992 | 52 | 1992 |
| Effect of electrode pattern on the outputs of piezosensors for wire bonding process control SS Chiu, HLW Chan, SW Or, YM Cheung, PCK Liu Materials Science and Engineering: B 99 (1-3), 121-126, 2003 | 38 | 2003 |
| Vibration-induced die detachment system YM Cheung, MK Chow US Patent 7,757,742, 2010 | 33 | 2010 |
| Apparatus for semiconductor chip detachment YM Cheung, CK Liu, CH Yiu, CM Chong US Patent 7,240,422, 2007 | 29 | 2007 |
| Effect of plasma treatment of Au-Ni-Cu bond pads on process windows of Au wire bonding YH Chan, JK Kim, D Liu, PCK Liu, YM Cheung, MW Ng IEEE transactions on advanced packaging 28 (4), 674-684, 2005 | 24 | 2005 |
| Pick and place assembly for transporting a film of material YM Cheung, CM Chong US Patent 7,182,118, 2007 | 23 | 2007 |
| Piezoelectric sensor for measuring bonding parameters LW Chan-Wong, S San Chiu, SW Or, YM Cheung US Patent 6,279,810, 2001 | 23 | 2001 |
| Reliability of fan-out wafer-level packaging with large chips and multiple re-distributed layers J Lau, M Li, L Yang, M Li, QX Yong, Z Cheng, T Chen, I Xu, N Fan, E Kuah, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1574-1582, 2018 | 22 | 2018 |
| A high throughput and reliable thermal compression bonding process for advanced interconnections M Li, DW Tian, YM Cheung, L Yang, JH Lau 2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 603-608, 2015 | 22 | 2015 |
| Finite element stress analysis of thin die detachment process ACM Chong, YM Cheung Fifth International Conference onElectronic Packaging Technology Proceedings …, 2003 | 20 | 2003 |
| Simulation of the alignment sensitivity on the coupling efficiency of a ball-lens capped TO-can laser diode source into a single-mode fiber YM Cheung, CH Yiu Proceedings of the 4th International Symposium on Electronic Materials and …, 2002 | 20 | 2002 |
| Die detachment apparatus comprising pre-peeling structure YM Cheung, S Yao, GP Widdowson US Patent 7,665,204, 2010 | 19 | 2010 |
| Peeling device for chip detachment YM Cheung, CM Chong, CH Yiu US Patent App. 10/857,067, 2005 | 19 | 2005 |
Swapan K. GayenProfessor of Physics, City College of the City University of New YorkVerified email at ccny.cuny.edu
