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Co-authors
- Sebastian PazosResearch Scientist, Physical Science and Engineering, King Abdullah University of Science and TechVerified email at kaust.edu.sa
- Felix PalumboConsejo de Investigaciones Cientificas y Tecnicas - UTNVerified email at conicet.gov.ar
- Enrique MirandaUniversitat Autonoma de BarcelonaVerified email at uab.cat
- Mario LanzaIEEE Fellow | Associate Professor at National University of SingaporeVerified email at kaust.edu.sa
- Jordi SuñéProfessor, IEEE Fellow, Universitat Autònoma de BarcelonaVerified email at uab.cat
- Juan B. RoldánDepartment of Electronics and Computer Technology. Granada University (Spain)Verified email at ugr.es
- Moshe EizenbergTechnion and Guangdong Technion- Israel Institute of TechnologyVerified email at technion.ac.il
- Kaichen ZhuKing Abdullah University of Science and Technology, University of BarcelonaVerified email at kaust.edu.sa
- Mireia Bargalló GonzalezInstitut de Microelectrònica de Barcelona IMB-CNM (CSIC)Verified email at csic.es
- Santiago Boyeras BaldomáVerified email at frba.utn.edu.ar
- Francesca Campabadal SeguraInstitut de Microelectronica de Barcelona, IMB-CNM, CSICVerified email at imb-cnm.csic.es
- Salvatore LombardoCNR-IMMVerified email at imm.cnr.it
- Fei HuiZhengzhou UniversityVerified email at zzu.edu.cn
- David Maldonado CorreaIHP GmbH - Leibniz-Institute for innovative microelectronicsVerified email at ihp-microelectronics.com
- Fernando SilveiraProfessor, Electrical Engineering, Universidad de la Republica, UruguayVerified email at fing.edu.uy
- Lambert AlffTU DarmstadtVerified email at tu-darmstadt.de
- Eszter PirosTechnische Universität DarmstadtVerified email at tu-darmstadt.de
- Francisco Jiménez-MolinosUniversidad de GranadaVerified email at ugr.es
- Igor KrylovTechnion-Israel Institute of TechnologyVerified email at technion.ac.il
- Roy WinterPhD. in Materials Science & EngineeringVerified email at tx.technion.ac.il