| Experiment and numerical analysis for edge and corner bonded PoP bottom package assemblies under four-point bending H Shi, F Che, T Ueda Microelectronics Reliability 51 (9-11), 1850-1855, 2011 | 27 | 2011 |
| Analysis of edge and corner bonded PSvfBGA reliability under thermal cycling conditions by experimental and finite element methods H Shi, FX Che, C Tian, R Zhang, JT Park, T Ueda Microelectronics Reliability 52 (9-10), 1870-1875, 2012 | 21 | 2012 |
| Comparative studies on solder joint reliability of CTBGA assemblies with various adhesives using the array-based package shear test H Shi, T Ueda Microelectronics Reliability 51 (9-11), 1898-1902, 2011 | 19 | 2011 |
| Effects of edge and corner bond adhesives on the drop reliability of package-on-package bottom package assemblies H Shi, T Ueda Proceedings of the 3rd International Conference on Computer Research and …, 2011 | 13 | 2011 |
| Investigation of various board-level underfills and adhesives for CTBGA bend performance enhancements in lead-free portable electronic products H Shi, T Ueda 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 12 | 2011 |
| Thermo-mechanical reliability optimization of MEMS-based quartz resonator using validated finite element model R Zhang, H Shi, Y Dai, JT Park, T Ueda Microelectronics Reliability 52 (9-10), 2331-2335, 2012 | 9 | 2012 |
| Systematic studies of second level interconnection reliability of edge and corner bonded lead-free array-based packages under mechanical and thermal loading H Shi, D Yu, T Ueda 2012 IEEE 62nd Electronic Components and Technology Conference, 965-976, 2012 | 9 | 2012 |
| Thermomechanical fatigue performance of lead-free chip scale package assemblies with fast cure and reworkable capillary flow underfills H Shi, C Tian, T Ueda Japanese Journal of Applied Physics 51 (5S), 05EE04, 2012 | 9 | 2012 |
| A novel method for evaluating triaxial strain gages used in printed circuit board assemblies (PCBA) strain monitoring S Hongbin, I Satoshi, U Toshitsugu 2011 IEEE Sensors, 1697-1700, 2011 | 8* | 2011 |
| Integrated circuit package component with ball conducting joints HB Shi, JC Wu US Patent App. 12/805,326, 2011 | 8 | 2011 |
| Study on the bend performance of package stackable very thin fine pitch ball grid array assemblies with edge and corner bond adhesives H Shi, T Ueda 2011 3rd International Conference on Computer Research and Development 3 …, 2011 | 8 | 2011 |
| Mitigation of thermal fatigue failure in fully underfilled lead-free array-based package assemblies using partial underfills HB Shi, T Ueda 2011 IEEE 13th Electronics Packaging Technology Conference, 542-547, 2011 | 7 | 2011 |
| Thermal cycling reliability of lead-free package stackable very thin fine pitch ball grid array assemblies with reworkable edge and corner bond adhesives H Shi, T Ueda 2011 12th International Conference on Electronic Packaging Technology and …, 2011 | 7 | 2011 |
| Thermomechanical reliability analysis and optimization for MEMS packages with AuSn solder R Zhang, H Shi, T Ueda, J Zhang, Y Dai 2012 International Conference on Quality, Reliability, Risk, Maintenance …, 2012 | 6 | 2012 |
| Halogen-free and reworkable corner bond adhesive for array-based packages and the impact on board-level solder joint reliability H Shi, T Ueda Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2011 …, 2011 | 6 | 2011 |
| Board-Level Shear, Bend, Drop and Thermal Cycling Reliability of Lead-Free Chip Scale Packages with Partial Underfill: A Low-Cost Alternative to Full Underfill H Shi, C Tian, M Pecht, T Ueda 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC), 774 - 785, 2012 | 5 | 2012 |
| A comprehensive analysis of the thermal cycling reliability of lead-free chip scale package assemblies with various reworkable board-level polymeric reinforcement strategies H Shi, C Tian, D Yu, T Ueda Electronic Packaging Technology and High Density Packaging (ICEPT-HDP), 2012 …, 2012 | 5 | 2012 |
| Board-level solder joint reliability of edge-and corner-bonded lead-free chip scale package assemblies subjected to thermal cycling H Shi, C Tian, T Ueda Japanese Journal of Applied Physics 51 (4S), 04DB08, 2012 | 5 | 2012 |
| Investigation on the optimum sampling rate of strain measurement during printed circuit board (PCB) system assembly HB Shi, T Ueda 2011 IEEE 13th Electronics Packaging Technology Conference, 579-584, 2011 | 5 | 2011 |
| Effect of temperature on the fatigue damage of SAC305 solder X Long, Y Guo, X Chang, Y Su, H Shi, T Huang, B Tu, Y Wu 2021 22nd International Conference on Electronic Packaging Technology (ICEPT …, 2021 | 4 | 2021 |
