| Design, modeling and simulation of MEMS devices on Si, SiC, and diamond for harsh environment applications A Kociubiński, T Bieniek, G Janczyk Acta Physica Polonica A 125 (6), 1374-1376, 2014 | 17 | 2014 |
| Reliability of sputtered thin aluminium films under accelerated stress testing by vibration loading and modeling B Wunderle, T Onken, J Heilmann, D Silbernagl, J Arnold, T Bieniek, ... 2016 6th Electronic System-Integration Technology Conference (ESTC), 1-14, 2016 | 16 | 2016 |
| MEMS Product Engineering: Handling the Diversity of an Emerging Technology. Best Practices for Cooperative Development D Ortloff, T Schmidt, K Hahn, T Bieniek, G Janczyk, R Brück Springer Science & Business Media, 2013 | 15 | 2013 |
| Fabrication of high aspect ratio microtube arrays for 2D photonic crystals C Kraeh, A Popsecu, M Schieber, H Hedler, T Bieniek, G Wielgoszewski, ... Materials Research Express 1 (2), 026201, 2014 | 12 | 2014 |
| The first and european sic eigth inches pilot line reaction project as a driver for key european sic technologies focused on power electronics development T Bieniek, G Janczyk, A Sitnik, AA Messina TechConnect Briefs, 256-259, 2019 | 11 | 2019 |
| Customer-oriented product engineering of micro and nano devices T Bieniek, G Janczyk, P Grabiec, J Szynka, S Kaliciński, P Janus, ... Proceedings of the 17th International Conference Mixed Design of Integrated …, 2010 | 11 | 2010 |
| High cycle fatigue testing and modelling of sputtered aluminium thin films on vibrating silicon MEMS cantilevers T Onken, J Heilmann, T Bieniek, R Pufall, B Wunderle 2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016 | 10 | 2016 |
| Multi-Domain Modeling and Simulations of the Heterogeneous Systems T Pieniek, G Janczyk, P Janusz, J Szynka, P Grabiec, A Kociubiński, ... Journal of Telecommunications and Information Technology, 34-39, 2010 | 10 | 2010 |
| Modeling, simulation and calibration of silicon wet etching A Kociubiński, M Duk, T Bieniek, P Janus Journal of Telecommunications and Information Technology, 65-70, 2009 | 9 | 2009 |
| Investigation on reliability of interconnects in 3D heterogeneous systems by ageing beam resonance method G Janczyk, T Bieniek, J Wasowski, P Grabiec Microelectronics Journal 45 (7), 981-987, 2014 | 8 | 2014 |
| MEMS product engineering D Ortloff, T Schmidt, K Hahn, T Bieniek, G Janczyk, R Brück, D Ortloff, ... MEMS Product Engineering: Handling the Diversity of an Emerging Technology …, 2014 | 8 | 2014 |
| MEMS product engineering D Ortloff, T Schmidt, K Hahn, T Bieniek, G Janczyk, R Brück, D Ortloff, ... MEMS Product Engineering: Handling the Diversity of an Emerging Technology …, 2014 | 8 | 2014 |
| Dedicated MEMS-based test structure for 3D SiP interconnects reliability investigation T Bieniek, G Janczyk, R Dobrowolski, D Szmigiel, M Ekwińska, P Grabiec, ... 2013 IEEE International 3D Systems Integration Conference (3DIC), 1-6, 2013 | 8 | 2013 |
| Efficient scenarios, methodology and tools for MEMS/NEMS product development T Bieniek, G Janczyk, P Janus, M Ekwińska, D Szmigiel, K Domański, ... Proceedings of the 10th international conference on multi-material micro …, 2013 | 7 | 2013 |
| Integrated multi-domain modeling and simulation of complex 3D micro-and nanostructures T Bieniek, G Janczyk, P Janus, A Kociubinski, P Grabiec, J Szynka 2nd European Conference & Exhibition on Integration Issues of Miniaturized …, 2008 | 7 | 2008 |
| Modeling and Co-Simulation of Integrated Microand Nanosystems P Janus, T Bieniek, A Kociubinski, P Grabiec, G Schopfer 2007 14th International Conference on Mixed Design of Integrated Circuits …, 2007 | 7 | 2007 |
| Silicon nanowires reliability and robustness investigation using AFM-based techniques T Bieniek, G Janczyk, P Janus, P Grabiec, M Nieprzecki, G Wielgoszewski, ... Electron Technology Conference 2013 8902, 654-659, 2013 | 6 | 2013 |
| Optimization on MEMS-IC SiP development reliable design methods G Janczyk, T Bieniek, P Grabiec, A Wymysłowski, R Swierczyński Third IEEE International Workshop on Testing Three-Dimensional Stacked …, 2012 | 6 | 2012 |
| Determination of electrical and mechanical parameters in capacitive MEMS accelerometers using electrical measurements S Kaliciński, T Bieniek, P Janus, P Grabiec Microelectronics Reliability 51 (7), 1192-1197, 2011 | 6 | 2011 |
| Implementation of fd soi cmos technology in ite C RENAUX, A CRAHAY, M GRODNER, A PANAS, A SIERAKOWSKI, ... Elektronika, 13, 2011 | 6 | 2011 |
